Inventor
JANG JAE-GWON
KR15 patents
⚠️ This page may combine multiple inventors who share the name “JANG JAE-GWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS11404346B2Aug 2, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations83
US9893020B2Feb 13, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations72
US9627327B2Apr 18, 2017
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9024448B2May 5, 2015
Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US8884446B2Nov 11, 2014
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations72
US10923650B2Feb 16, 2021
Magneto-resistive chip package including shielding structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US12046526B2Jul 23, 2024
Methods of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11715645B2Aug 1, 2023
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11328970B2May 10, 2022
Methods of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US11322368B2May 3, 2022
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12009277B2Jun 11, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11121064B2Sep 14, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52