Inventor

LEE BAIK-WOO

KR18 patents

⚠️ This page may combine multiple inventors who share the name “LEE BAIK-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE BAIK-WOO

SAMSUNG ELECTRONICS CO LTD

Semiconductor device

Printed circuit board and semiconductor packages including the same

Semiconductor package and method of manufacturing the same

Magneto-resistive chip package including shielding structure

Nitride semiconductor based power converting device

Power device and power device module

Power semiconductor devices

Semiconductor device package including bonding layer having Ag3Sn

SIEMENS MEDICAL SOLUTIONS USA INC

Chip-on-array with interposer for a multidimensional transducer array

Direct chip-on-array for a multidimensional transducer array

Direct chip-on-array for a multidimensional transducer array

Chip-on-array with interposer for a multidimensional transducer array

Ultrasound transducer and manufacturing method thereof

LEE BAIK-WOO

Multilayer laminate package and method of manufacturing the same

Embedded actives and discrete passives in a cavity within build-up layers

Folded stacked package and method of manufacturing the same

Semiconductor package

JANG JAE GWON

Magneto-resistive chip package including shielding structure