Inventor
BRUN XAVIER FRANCOIS
US16 patents
⚠️ This page may combine multiple inventors who share the name “BRUN XAVIER FRANCOIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS11302643B2Apr 12, 2022
Microelectronic component having molded regions with through-mold vias
INTEL CORP5 citations83
US12176292B2Dec 24, 2024
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US11817390B2Nov 14, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US12368089B2Jul 22, 2025
Low cost embedded integrated circuit dies
INTEL CORP0 citations62
US12347782B2Jul 1, 2025
Microelectronic assemblies with direct attach to circuit boards
INTEL CORP1 citations62
US11640942B2May 2, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP0 citations61
US12412868B2Sep 9, 2025
Microelectronic assemblies including interconnects with different solder materials
INTEL CORP0 citations60
US12581988B2Mar 17, 2026
Microelectronic assemblies with through die attach film connections
INTEL CORP0 citations59
US12557675B2Feb 17, 2026
Inorganic redistribution layer on organic substrate in integrated circuit packages
INTEL CORP0 citations57
US12538841B2Jan 27, 2026
Quasi-monolithic die architectures
INTEL CORP0 citations50
HIRAKAWA OSAMU
3 patentsUS9919509B2Mar 20, 2018
Peeling device, peeling system and peeling method
HIRAKAWA OSAMU2 citations69
US9956755B2May 1, 2018
Separation method, separation apparatus, and separation system
HIRAKAWA OSAMU0 citations38
US9827756B2Nov 28, 2017
Separation apparatus, separation system, and separation method
HIRAKAWA OSAMU0 citations38