P

Inventor

SON SOO HWAN

KR66 patents
⚠️ This page may combine multiple inventors who share the name “SON SOO HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

45 patents
US10446323B1Oct 15, 2019

Electronic component having multilayer capacitor, interposer, and adhesive layer

SAMSUNG ELECTRO MECH16 citations86
US10347425B2Jul 9, 2019

Multilayer electronic component and board having the same

SAMSUNG ELECTRO MECH12 citations84
US10249438B1Apr 2, 2019

Multilayer ceramic capacitor and board having the same

SAMSUNG ELECTRO MECH12 citations84
US10056193B1Aug 21, 2018

Multilayer ceramic electronic component and board having the same mounted thereon

SAMSUNG ELECTRO MECH10 citations84
US9536647B2Jan 3, 2017

Multi-layered chip electronic component

SAMSUNG ELECTRO MECH7 citations83
US11289275B2Mar 29, 2022

Composite electronic component

SAMSUNG ELECTRO MECH2 citations73
US11043333B2Jun 22, 2021

Composite electronic component

SAMSUNG ELECTRO MECH2 citations73
US9877381B2Jan 23, 2018

Composite electronic component and board on which composite electronic component is mounted

SAMSUNG ELECTRO MECH2 citations73
US9390862B2Jul 12, 2016

Composite electronic component and board with the same mounted thereon

SAMSUNG ELECTRO MECH5 citations73
US10321571B2Jun 11, 2019

Composite electronic component and board having the same

SAMSUNG ELECTRO MECH2 citations72
US10542626B2Jan 21, 2020

Multilayer electronic component and board having the same

SAMSUNG ELECTRO MECH6 citations71
US10403441B2Sep 3, 2019

Composite electronic component

SAMSUNG ELECTRO MECH2 citations71
US11733315B2Aug 22, 2023

Apparatus for detecting stacking direction of internal electrode of multilayer capacitor and detecting method thereof

SAMSUNG ELECTRO MECH0 citations63
US10770237B2Sep 8, 2020

Multilayer electronic component

SAMSUNG ELECTRO MECH1 citations63
US12249466B2Mar 11, 2025

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations62
US12014876B2Jun 18, 2024

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations62
US11908627B2Feb 20, 2024

Multilayer electronic component

SAMSUNG ELECTRO MECH1 citations62
US11087923B2Aug 10, 2021

Multi-layered ceramic capacitor

SAMSUNG ELECTRO MECH0 citations62
US10937581B2Mar 2, 2021

Hybrid inductor and manufacturing method thereof

SAMSUNG ELECTRO MECH1 citations62
US10553361B2Feb 4, 2020

Multilayer capacitor, method of manufacturing the same, and board having the same

SAMSUNG ELECTRO MECH1 citations62
US11610740B2Mar 21, 2023

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH1 citations61
US11206737B2Dec 21, 2021

Composite electronic component and board having the same

SAMSUNG ELECTRO MECH1 citations61
US11166375B2Nov 2, 2021

Composite electronic component and board having the same

SAMSUNG ELECTRO MECH0 citations61
US11094461B2Aug 17, 2021

Composite electronic component and board having the same

SAMSUNG ELECTRO MECH0 citations61
US10910163B2Feb 2, 2021

Multilayer electronic component and board having the same mounted thereon

SAMSUNG ELECTRO MECH0 citations61
US12406810B2Sep 2, 2025

Ceramic electronic component having external electrode which includes boron with high ratio of isotope 10B

SAMSUNG ELECTRO MECH0 citations56
US12040137B2Jul 16, 2024

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations52
US11948745B2Apr 2, 2024

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations52
US11328871B2May 10, 2022

Composite electronic component

SAMSUNG ELECTRO MECH0 citations52
US11322306B2May 3, 2022

Composite electronic component

SAMSUNG ELECTRO MECH0 citations52
US10748707B2Aug 18, 2020

Electronic component

SAMSUNG ELECTRO MECH0 citations52
US10707023B2Jul 7, 2020

Electronic components

SAMSUNG ELECTRO MECH0 citations52
US10593484B2Mar 17, 2020

Electronic components

SAMSUNG ELECTRO MECH0 citations52
US10460875B2Oct 29, 2019

Multilayer electronic component and board having the same

SAMSUNG ELECTRO MECH0 citations52
US9530554B2Dec 27, 2016

Multilayer coil component

SAMSUNG ELECTRO MECH0 citations52
US9147517B2Sep 29, 2015

Multilayer coil component

SAMSUNG ELECTRO MECH0 citations52
US12525400B2Jan 13, 2026

Composite electronic component

SAMSUNG ELECTRO MECH0 citations51
US12308172B2May 20, 2025

Multilayer capacitor and board component having the same

SAMSUNG ELECTRO MECH0 citations51
US12033803B2Jul 9, 2024

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations51
US11477891B2Oct 18, 2022

Electronic component

SAMSUNG ELECTRO MECH0 citations51
US11276528B2Mar 15, 2022

Electronic component

SAMSUNG ELECTRO MECH0 citations51
US10236104B2Mar 19, 2019

Ferrite and inductor including the same

SAMSUNG ELECTRO MECH0 citations51
US9894768B2Feb 13, 2018

Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon

SAMSUNG ELECTRO MECH1 citations51
US9824791B2Nov 21, 2017

Multilayer electronic component and conductive paste composition for internal electrode

SAMSUNG ELECTRO MECH0 citations51
US9576697B2Feb 21, 2017

Multilayer electronic component and conductive paste composition for internal electrode

SAMSUNG ELECTRO MECH0 citations51

KIM MYEONG GI

2 patents

MOON BYEONG CHEOL

1 patent

AN SUNG YONG

1 patent

SON SOO HWAN

1 patent

Showing the top 50 of 66 patents by PatentIndex Score.