Inventor
SON SOO HWAN
KR66 patents
⚠️ This page may combine multiple inventors who share the name “SON SOO HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
45 patentsUS10446323B1Oct 15, 2019
Electronic component having multilayer capacitor, interposer, and adhesive layer
SAMSUNG ELECTRO MECH16 citations86
US10347425B2Jul 9, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10249438B1Apr 2, 2019
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10056193B1Aug 21, 2018
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH10 citations84
US9536647B2Jan 3, 2017
Multi-layered chip electronic component
SAMSUNG ELECTRO MECH7 citations83
US11289275B2Mar 29, 2022
Composite electronic component
SAMSUNG ELECTRO MECH2 citations73
US11043333B2Jun 22, 2021
Composite electronic component
SAMSUNG ELECTRO MECH2 citations73
US9877381B2Jan 23, 2018
Composite electronic component and board on which composite electronic component is mounted
SAMSUNG ELECTRO MECH2 citations73
US9390862B2Jul 12, 2016
Composite electronic component and board with the same mounted thereon
SAMSUNG ELECTRO MECH5 citations73
US10321571B2Jun 11, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations72
US10542626B2Jan 21, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH6 citations71
US10403441B2Sep 3, 2019
Composite electronic component
SAMSUNG ELECTRO MECH2 citations71
US11733315B2Aug 22, 2023
Apparatus for detecting stacking direction of internal electrode of multilayer capacitor and detecting method thereof
SAMSUNG ELECTRO MECH0 citations63
US10770237B2Sep 8, 2020
Multilayer electronic component
SAMSUNG ELECTRO MECH1 citations63
US12249466B2Mar 11, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations62
US12014876B2Jun 18, 2024
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations62
US11908627B2Feb 20, 2024
Multilayer electronic component
SAMSUNG ELECTRO MECH1 citations62
US11087923B2Aug 10, 2021
Multi-layered ceramic capacitor
SAMSUNG ELECTRO MECH0 citations62
US10937581B2Mar 2, 2021
Hybrid inductor and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations62
US10553361B2Feb 4, 2020
Multilayer capacitor, method of manufacturing the same, and board having the same
SAMSUNG ELECTRO MECH1 citations62
US11610740B2Mar 21, 2023
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations61
US11206737B2Dec 21, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH1 citations61
US11166375B2Nov 2, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations61
US11094461B2Aug 17, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations61
US10910163B2Feb 2, 2021
Multilayer electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations61
US12406810B2Sep 2, 2025
Ceramic electronic component having external electrode which includes boron with high ratio of isotope 10B
SAMSUNG ELECTRO MECH0 citations56
US12040137B2Jul 16, 2024
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations52
US11948745B2Apr 2, 2024
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations52
US11328871B2May 10, 2022
Composite electronic component
SAMSUNG ELECTRO MECH0 citations52
US11322306B2May 3, 2022
Composite electronic component
SAMSUNG ELECTRO MECH0 citations52
US10748707B2Aug 18, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10707023B2Jul 7, 2020
Electronic components
SAMSUNG ELECTRO MECH0 citations52
US10593484B2Mar 17, 2020
Electronic components
SAMSUNG ELECTRO MECH0 citations52
US10460875B2Oct 29, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US9530554B2Dec 27, 2016
Multilayer coil component
SAMSUNG ELECTRO MECH0 citations52
US9147517B2Sep 29, 2015
Multilayer coil component
SAMSUNG ELECTRO MECH0 citations52
US12525400B2Jan 13, 2026
Composite electronic component
SAMSUNG ELECTRO MECH0 citations51
US12308172B2May 20, 2025
Multilayer capacitor and board component having the same
SAMSUNG ELECTRO MECH0 citations51
US12033803B2Jul 9, 2024
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations51
US11477891B2Oct 18, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations51
US11276528B2Mar 15, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations51
US10236104B2Mar 19, 2019
Ferrite and inductor including the same
SAMSUNG ELECTRO MECH0 citations51
US9894768B2Feb 13, 2018
Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon
SAMSUNG ELECTRO MECH1 citations51
US9824791B2Nov 21, 2017
Multilayer electronic component and conductive paste composition for internal electrode
SAMSUNG ELECTRO MECH0 citations51
US9576697B2Feb 21, 2017
Multilayer electronic component and conductive paste composition for internal electrode
SAMSUNG ELECTRO MECH0 citations51
KIM MYEONG GI
2 patentsMOON BYEONG CHEOL
1 patentAN SUNG YONG
1 patentSON SOO HWAN
1 patentShowing the top 50 of 66 patents by PatentIndex Score.