Inventor
AHN YOUNG GHYU
KR185 patents
⚠️ This page may combine multiple inventors who share the name “AHN YOUNG GHYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
48 patentsUS8351181B1Jan 8, 2013
Chip type laminated capacitor
SAMSUNG ELECTRO MECH35 citations94
US8351180B1Jan 8, 2013
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH22 citations93
US10347425B2Jul 9, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10249438B1Apr 2, 2019
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10236126B2Mar 19, 2019
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH4 citations84
US10079089B1Sep 18, 2018
Coil electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9984828B2May 29, 2018
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH5 citations84
US9893703B2Feb 13, 2018
Multilayer electronic component
SAMSUNG ELECTRO MECH8 citations84
US9843299B2Dec 12, 2017
Multilayer electronic component
SAMSUNG ELECTRO MECH8 citations84
US9799453B2Oct 24, 2017
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9793053B2Oct 17, 2017
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH5 citations84
US9706641B1Jul 11, 2017
Multilayer capacitor and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9653212B2May 16, 2017
Multilayer ceramic capacitor and board for mounting thereof
SAMSUNG ELECTRO MECH9 citations84
US9576711B2Feb 21, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9491847B2Nov 8, 2016
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9478334B2Oct 25, 2016
Magnetic module for power inductor, power inductor, and manufacturing method thereof
SAMSUNG ELECTRO MECH8 citations84
US9439301B2Sep 6, 2016
Multilayered chip electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations84
US9373446B2Jun 21, 2016
Multilayer ceramic electronic part, board having the same mounted thereon, and manufacturing method thereof
SAMSUNG ELECTRO MECH13 citations84
US9288906B2Mar 15, 2016
Mounting circuit board of multilayer ceramic capacitor
SAMSUNG ELECTRO MECH13 citations84
US9236186B2Jan 12, 2016
Multi-layered ceramic capacitor
SAMSUNG ELECTRO MECH7 citations84
US9087646B2Jul 21, 2015
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH7 citations84
US9048026B2Jun 2, 2015
Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH12 citations84
US8934215B2Jan 13, 2015
Laminated chip electronic component, board for mounting the same, and packing unit thereof
SAMSUNG ELECTRO MECH8 citations84
US8804367B2Aug 12, 2014
Multilayer ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH13 citations84
US8385048B2Feb 26, 2013
Chip type laminated capacitor
SAMSUNG ELECTRO MECH5 citations84
US8373964B2Feb 12, 2013
Multi-layered ceramic capacitor
SAMSUNG ELECTRO MECH12 citations84
US9685272B2Jun 20, 2017
Multilayer ceramic capacitor having multilayer external electrodes and board having the same
SAMSUNG ELECTRO MECH8 citations83
US11756724B2Sep 12, 2023
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11443894B2Sep 13, 2022
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11424065B2Aug 23, 2022
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11342124B2May 24, 2022
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US11170927B2Nov 9, 2021
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11139113B2Oct 5, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US11075030B2Jul 27, 2021
Inductor array
SAMSUNG ELECTRO MECH2 citations73
US10847320B2Nov 24, 2020
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US10840022B2Nov 17, 2020
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10777356B2Sep 15, 2020
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10622154B2Apr 14, 2020
Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US10607765B2Mar 31, 2020
Coil component and board having the same
SAMSUNG ELECTRO MECH4 citations73
US10559413B2Feb 11, 2020
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US10304618B2May 28, 2019
Electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations73
US10192685B2Jan 29, 2019
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH5 citations73
US10135418B2Nov 20, 2018
Common mode filter
SAMSUNG ELECTRO MECH2 citations73
US9978522B2May 22, 2018
Multilayer ceramic capacitor and mounting board therefor
SAMSUNG ELECTRO MECH2 citations73
US9820383B2Nov 14, 2017
Multilayer ceramic capacitor having three external electrodes and board having the same
SAMSUNG ELECTRO MECH3 citations73
US9743524B1Aug 22, 2017
Chip electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH2 citations73
US9728334B2Aug 8, 2017
Multilayer ceramic capacitor and board for mounting thereof
SAMSUNG ELECTRO MECH2 citations73
US9655247B1May 16, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH6 citations73
AHN YOUNG GHYU
1 patentYOO YOUNG SEUCK
1 patentShowing the top 50 of 185 patents by PatentIndex Score.