Inventor

TACHIBANA YOSHIE

JP12 patents

Patents

12 patents

US11278955B2Mar 22, 2022

Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor

SENJU METAL INDUSTRY CO2 citations70

US9837757B2Dec 5, 2017

Lead-free solder alloy and in-vehicle electronic circuit

SENJU METAL INDUSTRY CO2 citations69

US11911854B2Feb 27, 2024

Solder alloy, solder paste, solder preform and solder joint

SENJU METAL INDUSTRY CO1 citations61

US10968932B2Apr 6, 2021

Soldered joint and method for forming soldered joint

SENJU METAL INDUSTRY CO0 citations61

US10967464B2Apr 6, 2021

Solder alloy, solder paste, and solder joint

SENJU METAL INDUSTRY CO0 citations59

US12017306B2Jun 25, 2024

Solder paste

SENJU METAL INDUSTRY CO0 citations58

US11772204B2Oct 3, 2023

Preform solder and method of manufacturing the same, and method of manufacturing solder joint

SENJU METAL INDUSTRY CO0 citations57

US11628520B2Apr 18, 2023

Preform solder and method of manufacturing the same, and method of manufacturing solder joint

SENJU METAL INDUSTRY CO1 citations57

US11858071B2Jan 2, 2024

Solder alloy, solder paste, solder ball, solder preform, and solder joint

SENJU METAL INDUSTRY CO0 citations51

US11904416B2Feb 20, 2024

Solder alloy, solder powder, solder paste and solder joint

SENJU METAL INDUSTRY CO0 citations49

US10658107B2May 19, 2020

Method of manufacturing permanent magnet

SENJU METAL INDUSTRY CO0 citations49

US12290884B1May 6, 2025

Solder paste and solder joint

SENJU METAL INDUSTRY CO0 citations44