Inventor
KOIKE JUN
JP46 patents
⚠️ This page may combine multiple inventors who share the name “KOIKE JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA MACHINE CO LTD
26 patentsUS7168946B2Jan 30, 2007
Movable-die support device and die clamping unit
TOSHIBA MACHINE CO LTD21 citations92
US6309203B1Oct 30, 2001
Injection apparatus for injection molding machine
TOSHIBA MACHINE CO LTD21 citations92
US6270333B1Aug 7, 2001
Mold clamping apparatus for injection molding machine
TOSHIBA MACHINE CO LTD16 citations92
US6059556AMay 9, 2000
Injection apparatus for injection molding machine
TOSHIBA MACHINE CO LTD29 citations92
US6050804AApr 18, 2000
Clamping apparatus for injection molding machine
TOSHIBA MACHINE CO LTD31 citations92
US6325954B1Dec 4, 2001
Method of controlling electric injection unit of injection molding machine
TOSHIBA MACHINE CO LTD38 citations90
US6332355B1Dec 25, 2001
Method of estimating a life of ball screw included in electric injection molding machine and life estimating system
TOSHIBA MACHINE CO LTD17 citations83
US6144182ANov 7, 2000
Motor control method for injection molding machine and motor controller for carrying out the same
TOSHIBA MACHINE CO LTD16 citations83
US6537057B2Mar 25, 2003
Mold clamping apparatus for injection molding machine
TOSHIBA MACHINE CO LTD12 citations74
US6533573B2Mar 18, 2003
Mold clamping apparatus for injection molding machine
TOSHIBA MACHINE CO LTD8 citations74
US6132198AOct 17, 2000
Clamping apparatus for injection molding machine
TOSHIBA MACHINE CO LTD14 citations74
US6109036AAug 29, 2000
Sealed hydraulic intensifier
TOSHIBA MACHINE CO LTD12 citations74
US7566214B2Jul 28, 2009
Die clamping unit and die clamping method
TOSHIBA MACHINE CO LTD6 citations71
US6589456B1Jul 8, 2003
Method and apparatus for compensating mold thickness changes in toggle type clamping unit for injection molding machine
TOSHIBA MACHINE CO LTD11 citations71
US6821103B2Nov 23, 2004
Injection molding machine
TOSHIBA MACHINE CO LTD11 citations70
US7575426B2Aug 18, 2009
Clamping device and injection molding machine provided with clamping device
TOSHIBA MACHINE CO LTD2 citations62
US7373777B2May 20, 2008
Die drive unit of molding machine
TOSHIBA MACHINE CO LTD3 citations62
US6914537B2Jul 5, 2005
Method for monitoring operation data of an injection-molding machine
TOSHIBA MACHINE CO LTD4 citations62
US6984120B2Jan 10, 2006
Electric direct-acting die clamping unit of an injection molding machine
TOSHIBA MACHINE CO LTD2 citations61
US7416403B2Aug 26, 2008
Die clamping unit
TOSHIBA MACHINE CO LTD2 citations60
US6699026B2Mar 2, 2004
Injection molding apparatus
TOSHIBA MACHINE CO LTD4 citations60
US10464242B2Nov 5, 2019
Convey device, molded article manufacturing apparatus, and method of manufacturing molded article
TOSHIBA MACHINE CO LTD0 citations50
US10179432B2Jan 15, 2019
Convey device, molded article manufacturing apparatus, and method of manufacturing molded article
TOSHIBA MACHINE CO LTD0 citations50
US7867415B2Jan 11, 2011
Die clamping method
TOSHIBA MACHINE CO LTD0 citations50
US7820084B2Oct 26, 2010
Minute shape molding method and apparatus thereof
TOSHIBA MACHINE CO LTD1 citations50
US10105753B2Oct 23, 2018
Opening/closing apparatus and molding apparatus
TOSHIBA MACHINE CO LTD0 citations40
MURATA MANUFACTURING CO
5 patentsUS5569548AOct 29, 1996
Zinc oxide piezoelectric crystal film on sapphire plane
MURATA MANUFACTURING CO103 citations98
US5532537AJul 2, 1996
Zinc oxide piezoelectric crystal film on sapphire plane
MURATA MANUFACTURING CO7 citations74
US5432397AJul 11, 1995
Zinc oxide piezoelectric crystal film
MURATA MANUFACTURING CO10 citations74
US5625329AApr 29, 1997
Surface acoustic wave filter with an optimizing reflector thickness-to-wavelength ratio
MURATA MANUFACTURING CO4 citations63
US6800135B2Oct 5, 2004
ZnO/sapphire substrate and method for manufacturing the same
MURATA MANUFACTURING CO0 citations52
KOIKE JUN
4 patentsUS9263649B2Feb 16, 2016
Layered product for fine pattern formation and method of manufacturing layered product for fine pattern formation
KOIKE JUN13 citations79
US10184064B2Jan 22, 2019
Inorganic composition for transferring a fine unevenness
KOIKE JUN1 citations61
US8512608B2Aug 20, 2013
Injection molding method and injection molding device
KOIKE JUN2 citations54
US9513409B2Dec 6, 2016
Fine-structure layered product, preparation method of the fine-structure layered product and manufacturing method of a fine-structure product
KOIKE JUN1 citations48
ASAHI KASEI E MATERIALS CORP
3 patentsUS9660141B2May 23, 2017
Pattern wafer for LEDs, epitaxial wafer for LEDs and method of manufacturing the epitaxial wafer for LEDs
ASAHI KASEI E MATERIALS CORP5 citations73
US9419249B2Aug 16, 2016
Light extraction product for semiconductor light emitting device and light emitting device
ASAHI KASEI E MATERIALS CORP5 citations68
US9541684B2Jan 10, 2017
Substrate for optics and light emitting device
ASAHI KASEI E MATERIALS CORP0 citations41
ASAHI CHEMICAL IND
2 patentsUS10239279B2Mar 26, 2019
Function transfer product, functional layer transfer method, packed product, and function transfer film roll
ASAHI CHEMICAL IND5 citations71
US9614136B2Apr 4, 2017
Optical substrate, semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element
ASAHI CHEMICAL IND2 citations71