Inventor
JEONG DONG JIN
KR42 patents
⚠️ This page may combine multiple inventors who share the name “JEONG DONG JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
32 patentsUS9978501B2May 22, 2018
Coil electronic component and method of manufacturing same
SAMSUNG ELECTRO MECH7 citations84
US9349525B2May 24, 2016
Multilayer inductor
SAMSUNG ELECTRO MECH7 citations82
US9976224B2May 22, 2018
Chip electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH12 citations81
US9875837B2Jan 23, 2018
Coil electronic component
SAMSUNG ELECTRO MECH7 citations80
US10332667B2Jun 25, 2019
Electronic component having lead part including regions having different thicknesses and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations78
US10607769B2Mar 31, 2020
Electronic component including a spacer part
SAMSUNG ELECTRO MECH2 citations73
US10515750B2Dec 24, 2019
Coil electronic component with distance between lead portion and coil pattern greater than distance between adjacent coil patterns
SAMSUNG ELECTRO MECH6 citations73
US10256032B2Apr 9, 2019
Electronic component
SAMSUNG ELECTRO MECH3 citations73
US10170229B2Jan 1, 2019
Chip electronic component and board having the same
SAMSUNG ELECTRO MECH3 citations73
US10141097B2Nov 27, 2018
Electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US9892833B2Feb 13, 2018
Magnetic powder and coil electronic component containing the same
SAMSUNG ELECTRO MECH3 citations73
US9183979B2Nov 10, 2015
Chip inductor and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US8810351B2Aug 19, 2014
Chip-type coil component
SAMSUNG ELECTRO MECH5 citations73
US12278039B2Apr 15, 2025
Coil electronic component and method of manufacturing same
SAMSUNG ELECTRO MECH0 citations62
US12062476B2Aug 13, 2024
Chip electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations62
US11626233B2Apr 11, 2023
Chip electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations62
US11562848B2Jan 24, 2023
Coil electronic component and method of manufacturing same
SAMSUNG ELECTRO MECH0 citations62
US11469030B2Oct 11, 2022
Chip electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations62
US10923264B2Feb 16, 2021
Electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US10910145B2Feb 2, 2021
Chip electronic component
SAMSUNG ELECTRO MECH0 citations62
US10804021B2Oct 13, 2020
Chip electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US10734155B2Aug 4, 2020
Coil electronic component and method of manufacturing same
SAMSUNG ELECTRO MECH0 citations52
US10580563B2Mar 3, 2020
Coil component
SAMSUNG ELECTRO MECH0 citations52
US10553338B2Feb 4, 2020
Chip electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US10483024B2Nov 19, 2019
Coil electronic component
SAMSUNG ELECTRO MECH0 citations52
US10297377B2May 21, 2019
Chip electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US10141099B2Nov 27, 2018
Electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US10115518B2Oct 30, 2018
Coil electronic component
SAMSUNG ELECTRO MECH1 citations52
US9812247B2Nov 7, 2017
Electronic component
SAMSUNG ELECTRO MECH1 citations52
US9779867B2Oct 3, 2017
Electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US9607753B2Mar 28, 2017
Multilayer inductor
SAMSUNG ELECTRO MECH0 citations50
US10546681B2Jan 28, 2020
Electronic component having lead part including regions having different thicknesses and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations46