Inventor
GRIFFITH JONATHAN H
US17 patents
⚠️ This page may combine multiple inventors who share the name “GRIFFITH JONATHAN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS6531069B1Mar 11, 2003
Reactive Ion Etching chamber design for flip chip interconnections
IBM144 citations97
US6293457B1Sep 25, 2001
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization
IBM86 citations95
US5277749AJan 11, 1994
Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps
IBM132 citations93
US7144490B2Dec 5, 2006
Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer
IBM14 citations84
US6228665B1May 8, 2001
Method of measuring oxide thickness during semiconductor fabrication
IBM14 citations74
US6995475B2Feb 7, 2006
I/C chip suitable for wire bonding
IBM9 citations73
US9613842B2Apr 4, 2017
Wafer handler and methods of manufacture
IBM3 citations71
US4588471AMay 13, 1986
Process for etching composite chrome layers
IBM17 citations63
US7473997B2Jan 6, 2009
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
IBM4 citations62
US6992389B2Jan 31, 2006
Barrier for interconnect and method
IBM4 citations61
US8807184B2Aug 19, 2014
Reduction of edge chipping during wafer handling
IBM1 citations52
US7932169B2Apr 26, 2011
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
IBM1 citations51
US7572726B2Aug 11, 2009
Method of forming a bond pad on an I/C chip and resulting structure
IBM0 citations51