Inventor
GEYER HARRY J
US11 patents
⚠️ This page may combine multiple inventors who share the name “GEYER HARRY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
8 patentsUS4927505AMay 22, 1990
Metallization scheme providing adhesion and barrier properties
MOTOROLA INC184 citations97
US5467253ANov 14, 1995
Semiconductor chip package and method of forming
MOTOROLA INC109 citations95
US4880708ANov 14, 1989
Metallization scheme providing adhesion and barrier properties
MOTOROLA INC61 citations95
US4003073AJan 11, 1977
Integrated circuit device employing metal frame means with preformed conductor means
MOTOROLA INC30 citations80
US4943708AJul 24, 1990
Data device module having locking groove
MOTOROLA INC14 citations71
US4795077AJan 3, 1989
Bonding method and apparatus
MOTOROLA INC7 citations70
US5240165AAug 31, 1993
Method and apparatus for controlled deformation bonding
MOTOROLA INC8 citations65
US5232144AAug 3, 1993
Apparatus for tape automated bonding
MOTOROLA INC6 citations57
SEMITOOL INC
3 patentsUS6001234ADec 14, 1999
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
SEMITOOL INC30 citations90
US6461494B1Oct 8, 2002
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
SEMITOOL INC11 citations71
US6805778B1Oct 19, 2004
Contact assembly for supplying power to workpieces during electrochemical processing
SEMITOOL INC4 citations60