Inventor
WILCOX JAMES R
US23 patents
⚠️ This page may combine multiple inventors who share the name “WILCOX JAMES R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS5874776AFeb 23, 1999
Thermal stress relieving substrate
IBM107 citations98
US6373717B1Apr 16, 2002
Electronic package with high density interconnect layer
IBM97 citations97
US6104093AAug 15, 2000
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM92 citations97
US6410988B1Jun 25, 2002
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM45 citations96
US6351393B1Feb 26, 2002
Electronic package for electronic components and method of making same
IBM71 citations96
US5038996AAug 13, 1991
Bonding of metallic surfaces
IBM80 citations96
US6829823B2Dec 14, 2004
Method of making a multi-layered interconnect structure
IBM31 citations92
US5977642ANov 2, 1999
Dendrite interconnect for planarization and method for producing same
IBM20 citations92
US5442144AAug 15, 1995
Multilayered circuit board
IBM25 citations92
US5359767ANov 1, 1994
Method of making multilayered circuit board
IBM24 citations92
US6256874B1Jul 10, 2001
Conductor interconnect with dendrites through film and method for producing same
IBM13 citations82
US6562654B2May 13, 2003
Tented plated through-holes and method for fabrication thereof
IBM7 citations74
US6427323B2Aug 6, 2002
Method for producing conductor interconnect with dendrites
IBM7 citations74
US6300575B1Oct 9, 2001
Conductor interconnect with dendrites through film
IBM5 citations74
US6249045B1Jun 19, 2001
Tented plated through-holes and method for fabrication thereof
IBM13 citations74
US6228470B1May 8, 2001
Composite substrate for electronic components
IBM9 citations74
US7137826B2Nov 21, 2006
Temperature dependent semiconductor module connectors
IBM8 citations73
US7128579B1Oct 31, 2006
Hook interconnect
IBM7 citations73
US7024764B2Apr 11, 2006
Method of making an electronic package
IBM8 citations73
US7083901B2Aug 1, 2006
Joining member for Z-interconnect in electronic devices without conductive paste
IBM4 citations63
US6739046B1May 25, 2004
Method for producing dendrite interconnect for planarization
IBM3 citations63
US7255571B2Aug 14, 2007
Temperature dependent semiconductor module connectors
IBM1 citations52