Inventor
TAN ZHONGKUI
US26 patents
Patents
26 patentsUS9583357B1Feb 28, 2017
Systems and methods for reverse pulsing
LAM RES CORP98 citations99
US9761459B2Sep 12, 2017
Systems and methods for reverse pulsing
LAM RES CORP93 citations98
US9991128B2Jun 5, 2018
Atomic layer etching in continuous plasma
LAM RES CORP26 citations93
US9824896B2Nov 21, 2017
Methods and systems for advanced ion control for etching processes
LAM RES CORP4 citations84
US10943789B2Mar 9, 2021
Methods and systems for advanced ion control for etching processes
LAM RES CORP2 citations73
US10658194B2May 19, 2020
Silicon-based deposition for semiconductor processing
LAM RES CORP2 citations73
US10242845B2Mar 26, 2019
Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber
LAM RES CORP2 citations73
US9767991B2Sep 19, 2017
Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication
LAM RES CORP2 citations73
US10354888B2Jul 16, 2019
Method and apparatus for anisotropic tungsten etching
LAM RES CORP2 citations69
US9633867B2Apr 25, 2017
Method and apparatus for anisotropic tungsten etching
LAM RES CORP3 citations69
US12437966B2Oct 7, 2025
Systems and methods for reverse pulsing
LAM RES CORP0 citations62
US12165872B2Dec 10, 2024
Methods and systems for advanced ion control for etching processes
LAM RES CORP0 citations62
US11798785B2Oct 24, 2023
Systems for reverse pulsing
LAM RES CORP0 citations62
US11049726B2Jun 29, 2021
Methods and systems for advanced ion control for etching processes
LAM RES CORP0 citations62
US12217955B2Feb 4, 2025
Method for etching features using a targeted deposition for selective passivation
LAM RES CORP0 citations57
US11742212B2Aug 29, 2023
Directional deposition in etch chamber
LAM RES CORP0 citations56
US10177003B2Jan 8, 2019
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
LAM RES CORP0 citations52
US9859127B1Jan 2, 2018
Line edge roughness improvement with photon-assisted plasma process
LAM RES CORP0 citations52
US9691625B2Jun 27, 2017
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
LAM RES CORP0 citations52
US9852924B1Dec 26, 2017
Line edge roughness improvement with sidewall sputtering
LAM RES CORP1 citations51
US9997366B2Jun 12, 2018
Silicon oxide silicon nitride stack ion-assisted etch
LAM RES CORP0 citations49
US12581917B2Mar 17, 2026
Matching pre-processing and post-processing substrate samples
LAM RES CORP0 citations48
US12165878B2Dec 10, 2024
Semiconductor mask reshaping using a sacrificial layer
LAM RES CORP0 citations48
US11646207B2May 9, 2023
Silicon oxide silicon nitride stack stair step etch
LAM RES CORP0 citations48
US10020183B1Jul 10, 2018
Edge roughness reduction
LAM RES CORP0 citations47
US11037784B2Jun 15, 2021
Amorphous carbon layer opening process
LAM RES CORP0 citations40