Inventor

SANDERS PAUL W

US28 patents

⚠️ This page may combine multiple inventors who share the name “SANDERS PAUL W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDERS PAUL W

MOTOROLA INC

Multiple chip package with thinned semiconductor chips

MOSFET with substrate source contact

Method for forming a MOSFET with substrate source contact

Process for dielectrically isolated semiconductor structure

Method for forming bipolar transistor input protection

High frequency, power semiconductor device

Method for fabricating self-aligned semiconductor component

Method of making a semiconductor device having improved frequency response

Semiconductor device and method therefore

Fabrication of dielectrically isolated semiconductor device

Method of forming a semiconductor device

Semiconductor device and method of making

FREESCALE SEMICONDUCTOR INC

3-D circuits with integrated passive devices

Through substrate vias for back-side interconnections on very thin semiconductor wafers

Semiconductor through silicon vias of variable size and method of formation

Monolithic microwave integrated circuits

Methods of forming 3-D circuits with integrated passive devices

Methods of making a monolithic microwave integrated circuit

SANDERS PAUL W

Monolithic microwave integrated circuit

Through substrate vias

Through substrate VIAS

Prevention and treatment of cast nephropathy

INVENSAS CORP

Methods of forming 3-D circuits with integrated passive devices

Methods of forming 3-D circuits with integrated passive devices

Methods of forming 3-D circuits with integrated passive devices

DAO THUY B

Semiconductor structure having a through substrate via (TSV) and method for forming

RAMIAH CHANDRASEKARAM

Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods

TRW INC

Distributed collector ballast resistor structure