P

Inventor

YAMAGUCHI TADASHI

JP143 patents
⚠️ This page may combine multiple inventors who share the name “YAMAGUCHI TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKI ELECTRIC IND CO LTD

14 patents
US5157475AOct 20, 1992

Semiconductor device having a particular conductive lead structure

OKI ELECTRIC IND CO LTD299 citations99
US5886876AMar 23, 1999

Surface-mounted semiconductor package and its manufacturing method

OKI ELECTRIC IND CO LTD141 citations98
US6291892B1Sep 18, 2001

Semiconductor package that includes a shallow metal basin surrounded by an insulator frame

OKI ELECTRIC IND CO LTD53 citations96
US7193301B2Mar 20, 2007

Semiconductor device and manufacturing method thereof

OKI ELECTRIC IND CO LTD25 citations93
US7001798B2Feb 21, 2006

Method of manufacturing semiconductor device

OKI ELECTRIC IND CO LTD20 citations93
US5250470AOct 5, 1993

Method for manufacturing a semiconductor device with corrosion resistant leads

OKI ELECTRIC IND CO LTD27 citations93
US7443012B2Oct 28, 2008

Semiconductor device

OKI ELECTRIC IND CO LTD12 citations84
US7227263B2Jun 5, 2007

Semiconductor device with recessed post electrode

OKI ELECTRIC IND CO LTD12 citations84
US7022552B2Apr 4, 2006

Semiconductor device and method for fabricating semiconductor device

OKI ELECTRIC IND CO LTD17 citations84
US6531769B2Mar 11, 2003

Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit

OKI ELECTRIC IND CO LTD15 citations84
US6939740B2Sep 6, 2005

Method of fabricating an encapsulated semiconductor device with partly exposed leads

OKI ELECTRIC IND CO LTD9 citations74
US6885109B2Apr 26, 2005

Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same

OKI ELECTRIC IND CO LTD7 citations74
US6646325B2Nov 11, 2003

Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same

OKI ELECTRIC IND CO LTD11 citations74
US6198160B1Mar 6, 2001

Surface mounted type semiconductor device with wrap-around external leads

OKI ELECTRIC IND CO LTD9 citations74

RENESAS ELECTRONICS CORP

7 patents

YKK CORP

6 patents

YAMAGUCHI TADASHI

3 patents

SUMITOMO ELECTRIC HARDMETAL CORP

3 patents

YOSHIDA KOGYO KK

2 patents

MITSUI TOATSU CHEMICALS

2 patents

HONDA MOTOR CO LTD

2 patents

NIKON CORP

1 patent

MASUMOTO TSUYOSHI

1 patent

LION FAT OIL CO LTD

1 patent

AGENCY IND SCIENCE TECHN

1 patent

TAKENAKA KOMUTEN CO

1 patent

SANKEN ELECTRIC CO LTD

1 patent

NEC CORP

1 patent

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

AISAN IND

1 patent

MITSUBOSHI BELTING LTD

1 patent

SONY GROUP CORP

1 patent

Showing the top 50 of 143 patents by PatentIndex Score.