Inventor
SHIMOZAWA HIROSHI
JP7 patents
⚠️ This page may combine multiple inventors who share the name “SHIMOZAWA HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
6 patentsUS5223739AJun 29, 1993
Plastic molded semiconductor device having waterproof cap
TOSHIBA KK82 citations95
US5272377ADec 21, 1993
Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
TOSHIBA KK34 citations92
US5258426ANov 2, 1993
Semiconductor device encapsulant
TOSHIBA KK29 citations92
US5438113AAug 1, 1995
Thermosetting resin composition
TOSHIBA KK6 citations73
US5068267ANov 26, 1991
Semiconductor device encapsulant consisting of epoxy resin composition
TOSHIBA KK17 citations70
US5637667AJun 10, 1997
Thermosetting resin composition
TOSHIBA KK4 citations62