Inventor
KIM HO YOON
KR50 patents
⚠️ This page may combine multiple inventors who share the name “KIM HO YOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
49 patentsUS10325723B1Jun 18, 2019
Electronic component
SAMSUNG ELECTRO MECH20 citations94
US10446323B1Oct 15, 2019
Electronic component having multilayer capacitor, interposer, and adhesive layer
SAMSUNG ELECTRO MECH16 citations86
US10483040B1Nov 19, 2019
Electronic component
SAMSUNG ELECTRO MECH11 citations84
US10366839B1Jul 30, 2019
Electronic component
SAMSUNG ELECTRO MECH8 citations84
US10249438B1Apr 2, 2019
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH12 citations84
US9378884B2Jun 28, 2016
Multilayer electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH10 citations83
US11043333B2Jun 22, 2021
Composite electronic component
SAMSUNG ELECTRO MECH2 citations73
US10923282B2Feb 16, 2021
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10910155B2Feb 2, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10879000B2Dec 29, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH3 citations73
US10672562B2Jun 2, 2020
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10553362B1Feb 4, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH5 citations73
US10468195B1Nov 5, 2019
Multilayer ceramic electronic component array
SAMSUNG ELECTRO MECH4 citations73
US10242794B2Mar 26, 2019
Composite electronic component
SAMSUNG ELECTRO MECH2 citations73
US10043613B2Aug 7, 2018
Composite electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH4 citations73
US10542626B2Jan 21, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH6 citations71
US10448502B2Oct 15, 2019
Electronic component and board having electronic component mounted thereon
SAMSUNG ELECTRO MECH2 citations71
US10403441B2Sep 3, 2019
Composite electronic component
SAMSUNG ELECTRO MECH2 citations71
US10937581B2Mar 2, 2021
Hybrid inductor and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations62
US10580574B1Mar 3, 2020
Electronic component
SAMSUNG ELECTRO MECH1 citations62
US10553361B2Feb 4, 2020
Multilayer capacitor, method of manufacturing the same, and board having the same
SAMSUNG ELECTRO MECH1 citations62
US11206737B2Dec 21, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH1 citations61
US11166375B2Nov 2, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations61
US11094461B2Aug 17, 2021
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations61
US10910163B2Feb 2, 2021
Multilayer electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations61
US11289273B2Mar 29, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US11037730B2Jun 15, 2021
Electronic component having metal frames with insulating layers thereon
SAMSUNG ELECTRO MECH0 citations52
US10916376B2Feb 9, 2021
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10910157B2Feb 2, 2021
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10872724B2Dec 22, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH0 citations52
US10847313B2Nov 24, 2020
Electronic component and board for mounting of the same
SAMSUNG ELECTRO MECH0 citations52
US10790093B2Sep 29, 2020
Multilayer ceramic electronic component array
SAMSUNG ELECTRO MECH0 citations52
US10748707B2Aug 18, 2020
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US10707023B2Jul 7, 2020
Electronic components
SAMSUNG ELECTRO MECH0 citations52
US10593484B2Mar 17, 2020
Electronic components
SAMSUNG ELECTRO MECH0 citations52
US10446322B2Oct 15, 2019
Composite electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations52
US12308172B2May 20, 2025
Multilayer capacitor and board component having the same
SAMSUNG ELECTRO MECH0 citations51
US11562858B2Jan 24, 2023
Multilayer ceramic capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations51
US11276528B2Mar 15, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations51
US9894768B2Feb 13, 2018
Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereon
SAMSUNG ELECTRO MECH1 citations51
US10622147B2Apr 14, 2020
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations50
US11328870B2May 10, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations46
US9922762B2Mar 20, 2018
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations42
US10777351B2Sep 15, 2020
Complex electronic component
SAMSUNG ELECTRO MECH0 citations41
US10699846B2Jun 30, 2020
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations41
US10332680B2Jun 25, 2019
Composite electronic component
SAMSUNG ELECTRO MECH0 citations41
US9532443B2Dec 27, 2016
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations41
US10504655B2Dec 10, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations40
US9767950B2Sep 19, 2017
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations40