Inventor
KUROYANAGI AKIHISA
JP9 patents
⚠️ This page may combine multiple inventors who share the name “KUROYANAGI AKIHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS10475776B2Nov 12, 2019
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD2 citations71
US10541187B2Jan 21, 2020
Semiconductor package including organic interposer
SAMSUNG ELECTRONICS CO LTD2 citations70
US10504836B2Dec 10, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations70
US11195790B2Dec 7, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations59
US10854528B2Dec 1, 2020
Semiconductor package including organic interposer
SAMSUNG ELECTRONICS CO LTD0 citations49
US10692791B2Jun 23, 2020
Electronic component package with electromagnetic wave shielding
SAMSUNG ELECTRONICS CO LTD0 citations39
NITTO DENKO CORP
3 patentsUS6852263B2Feb 8, 2005
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
NITTO DENKO CORP4 citations58
US6646063B2Nov 11, 2003
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
NITTO DENKO CORP3 citations58
US6933618B2Aug 23, 2005
Tablet comprising epoxy resin composition
NITTO DENKO CORP0 citations47