Inventor

LAYSON ARLENE V

TH3 patents

⚠️ This page may combine multiple inventors who share the name “LAYSON ARLENE V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NS ELECTRONICS BANGKOK 1993 LT

2 patents

US7205180B1Apr 17, 2007

Process of fabricating semiconductor packages using leadframes roughened with chemical etchant

NS ELECTRONICS BANGKOK 1993 LT60 citations95

US7049683B1May 23, 2006

Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound

NS ELECTRONICS BANGKOK 1993 LT40 citations94

UTAC THAI LTD

1 patent

US7327017B2Feb 5, 2008

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

UTAC THAI LTD40 citations94