Inventor

CHUA YEE HEONG

SG4 patents

⚠️ This page may combine multiple inventors who share the name “CHUA YEE HEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NS ELECTRONICS BANGKOK 1993 LT

3 patents

US7205180B1Apr 17, 2007

Process of fabricating semiconductor packages using leadframes roughened with chemical etchant

NS ELECTRONICS BANGKOK 1993 LT60 citations95

US7049683B1May 23, 2006

Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound

NS ELECTRONICS BANGKOK 1993 LT40 citations94

US7153724B1Dec 26, 2006

Method of fabricating no-lead package for semiconductor die with half-etched leadframe

NS ELECTRONICS BANGKOK 1993 LT36 citations90

UTAC THAI LTD

1 patent

US7327017B2Feb 5, 2008

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

UTAC THAI LTD40 citations94