Inventor

ENG MEOW KOON

SG33 patents

⚠️ This page may combine multiple inventors who share the name “ENG MEOW KOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENG MEOW KOON

MICRON TECHNOLOGY INC

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Method of making multichip wafer level packages and computing systems incorporating same

Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead

Castellated chip-scale packages and methods for fabricating the same

Multi-chip wafer level system packages and methods of forming same

Multichip wafer level packages and computing systems incorporating same

Castellation wafer level packaging of integrated circuit chips

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages

Multichip wafer level packages and computing systems incorporating same

Multiple chip semiconductor package and method of fabricating same

Multiple chip semiconductor package

Multiple chip semiconductor package

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Castellation wafer level packaging of integrated circuit chips

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

Packaged microelectronic components

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

BOON SUAN JEUNG

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Semiconductor device assemblies and packages

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

ENG MEOW KOON

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods

APTINA IMAGING CORP

Microelectronic imagers and methods for manufacturing such microelectronic imagers