Inventor

CHUA SWEE KWANG

SG29 patents

⚠️ This page may combine multiple inventors who share the name “CHUA SWEE KWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUA SWEE KWANG

MICRON TECHNOLOGY INC

Method of making multichip wafer level packages and computing systems incorporating same

Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead

Method of forming a conductive via through a wafer

Multi-chip wafer level system packages and methods of forming same

Multichip wafer level packages and computing systems incorporating same

Castellation wafer level packaging of integrated circuit chips

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Wafer level packaging

Method for packaging circuits and packaged circuits

Leadless packaging for image sensor devices

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating same

Multiple chip semiconductor package and method of fabricating same

Multiple chip semiconductor package

Multiple chip semiconductor package

Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

CHUA SWEE KWANG

Wafer level packaging

Wafer level packaging

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Stackable semiconductor assemblies and methods of manufacturing such assemblies

CHIA YONG POO

Method for packaging circuits

Method for packaging circuits

APTINA IMAGING CORP

Thin semiconductor die packages and associated systems and methods