Inventor
YANG KE-CHUAN
TW10 patents
Patents
10 patentsUS6774499B1Aug 10, 2004
Non-leaded semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD71 citations96
US7084474B2Aug 1, 2006
Photosensitive semiconductor package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD36 citations92
US6787903B2Sep 7, 2004
Semiconductor device with under bump metallurgy and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD23 citations91
US6348401B1Feb 19, 2002
Method of fabricating solder bumps with high coplanarity for flip-chip application
SILICONWARE PRECISION INDUSTRIES CO LTD38 citations90
US7863731B2Jan 4, 2011
Heat-dissipating structure and heat-dissipating semiconductor package having the same
SILICONWARE PRECISION INDUSTRIES CO LTD10 citations84
US7999189B2Aug 16, 2011
Circuit board structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations83
US7170168B2Jan 30, 2007
Flip-chip semiconductor package with lead frame and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD11 citations83
US7056818B2Jun 6, 2006
Semiconductor device with under bump metallurgy and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD12 citations83
US6692629B1Feb 17, 2004
Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer
SILICONWARE PRECISION INDUSTRIES CO LTD16 citations81
US6821876B2Nov 23, 2004
Fabrication method of strengthening flip-chip solder bumps
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations61