Inventor
GHOSAL BALARAM
US9 patents
Patents
9 patentsUS7410833B2Aug 12, 2008
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM14 citations92
US5448016ASep 5, 1995
Selectively coated member having a shank with a portion masked
IBM26 citations90
US6998327B2Feb 14, 2006
Thin film transfer join process and multilevel thin film module
IBM27 citations88
US5868304AFeb 9, 1999
Socketable bump grid array shaped-solder on copper spheres
IBM19 citations80
US5670418ASep 23, 1997
Method of joining an electrical contact element to a substrate
IBM12 citations72
US5397598AMar 14, 1995
Method for selectively coating a member having a shank by masking a portion of the shank with a washer
IBM12 citations71
US8026613B2Sep 27, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM4 citations62
US7923849B2Apr 12, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM3 citations62
US6070782AJun 6, 2000
Socketable bump grid array shaped-solder on copper spheres
IBM3 citations59