Inventor
KILPATRICK STEPHEN
US6 patents
Patents
6 patentsUS7410833B2Aug 12, 2008
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM14 citations92
US6893799B2May 17, 2005
Dual-solder flip-chip solder bump
IBM22 citations91
US8026613B2Sep 27, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM4 citations62
US7923849B2Apr 12, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM3 citations62
US7037559B2May 2, 2006
Immersion plating and plated structures
IBM3 citations60
US7276296B2Oct 2, 2007
Immersion plating and plated structures
IBM1 citations49