Inventor
NYE III HENRY A
US20 patents
Patents
20 patentsUS5503286AApr 2, 1996
Electroplated solder terminal
IBM131 citations99
US5629564AMay 13, 1997
Electroplated solder terminal
IBM111 citations98
US5268072ADec 7, 1993
Etching processes for avoiding edge stress in semiconductor chip solder bumps
IBM119 citations96
US6261945B1Jul 17, 2001
Crackstop and oxygen barrier for low-K dielectric integrated circuits
IBM73 citations94
US7517736B2Apr 14, 2009
Structure and method of chemically formed anchored metallic vias
IBM34 citations93
US6133136AOct 17, 2000
Robust interconnect structure
IBM77 citations93
US7410833B2Aug 12, 2008
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM14 citations92
US6821890B2Nov 23, 2004
Method for improving adhesion to copper
IBM37 citations92
US6271595B1Aug 7, 2001
Method for improving adhesion to copper
IBM30 citations92
US6531759B2Mar 11, 2003
Alpha particle shield for integrated circuit
IBM19 citations91
US6486557B1Nov 26, 2002
Hybrid dielectric structure for improving the stiffness of back end of the line structures
IBM48 citations91
US6908841B2Jun 21, 2005
Support structures for wirebond regions of contact pads over low modulus materials
IBM56 citations90
US7273803B2Sep 25, 2007
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
IBM16 citations82
US6784516B1Aug 31, 2004
Insulative cap for laser fusing
IBM5 citations74
US6946379B2Sep 20, 2005
Insulative cap for laser fusing
IBM2 citations63
US8026613B2Sep 27, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM4 citations62
US7923849B2Apr 12, 2011
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
IBM3 citations62
US7037559B2May 2, 2006
Immersion plating and plated structures
IBM3 citations60
US7276296B2Oct 2, 2007
Immersion plating and plated structures
IBM1 citations49
US6900142B2May 31, 2005
Inhibition of tin oxide formation in lead free interconnect formation
IBM1 citations46