Inventor

PATEL CHIRAG S

US32 patents

⚠️ This page may combine multiple inventors who share the name “PATEL CHIRAG S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PATEL CHIRAG S

IBM

Conductive through via process for electronic device carriers

Semiconductor integrated circuit chip packages having integrated microchannel cooling modules

Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer

Chip system architecture for performance enhancement, power reduction and cost reduction

Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement

Silicon based optical vias

Method of manufacture of silicon based package and devices manufactured thereby

Fabrication of semiconductor dies with micro-pins and structures produced therewith

Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device

Silicon based package

Method to create flexible connections for integrated circuits

Conductive through via structure and process for electronic device carriers

Chip carrier substrate capacitor and method for fabrication thereof

GEORGIA TECH RES INST

Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability

Compliant wafer-level packaging devices and methods of fabrication

Devices having compliant wafer-level packages with pillars and methods of fabrication

KNICKERBOCKER JOHN U

Semiconductor device and method of making semiconductor device

Semiconductor device and method of making semiconductor device

Semiconductor device and method of making semiconductor device

ANDRY PAUL S

Silicon carrier optoelectronic packaging

Chip carrier substrate including capacitor and method for fabrication thereof

HAMEL HARVEY

Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections

Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections

DANG BING

Techniques for forming solder bump interconnects

Techniques for forming solder bump interconnects

CARS COM LLC

Method, system, and manufacture for personalized vehicle matching based upon user preferences

Systems and methods for identifying signals of low-quality listings

BUDD RUSSELL A

Silicon based optical vias

ANDRY PAUL STEPHEN

Silicon carrier structure and method of forming same

MAGERLEIN JOHN H

Method and manufacture of silicon based package and devices manufactured thereby

YAVUZ MEHMET

Generating access point beacons at different power levels

TOKGOZ YELIZ

Proximity based access control