P

Inventor

FUJIWARA HIDEMICHI

JP12 patents
⚠️ This page may combine multiple inventors who share the name “FUJIWARA HIDEMICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURUKAWA ELECTRIC CO LTD

6 patents
US6573454B2Jun 3, 2003

Electric distribution assembly

FURUKAWA ELECTRIC CO LTD20 citations90
US10818405B2Oct 27, 2020

Metal fine particle-containing composition

FURUKAWA ELECTRIC CO LTD2 citations72
US6867372B2Mar 15, 2005

Power cable for mobile and terminal for the power cable

FURUKAWA ELECTRIC CO LTD2 citations60
US12374646B2Jul 29, 2025

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

FURUKAWA ELECTRIC CO LTD0 citations56
US10626483B2Apr 21, 2020

Copper alloy wire rod

FURUKAWA ELECTRIC CO LTD0 citations51
US11466181B2Oct 11, 2022

Metal particle-containing composition and electrically conductive adhesive film

FURUKAWA ELECTRIC CO LTD0 citations46

HARADA TAKUYA

2 patents
US8337726B2Dec 25, 2012

Fine particle dispersion and method for producing fine particle dispersion

HARADA TAKUYA4 citations56
US8277693B2Oct 2, 2012

Method for producing fine particle dispersion and fine particle dispersion

HARADA TAKUYA1 citations46

KATAYAMA MASAKO

1 patent
US8475923B2Jul 2, 2013

Heat transfer film, semiconductor device, and electronic apparatus

KATAYAMA MASAKO9 citations76

MASUMORI SHUNJI

1 patent
US10046418B2Aug 14, 2018

Electrically conductive paste, and electrically conducive connection member produced using the paste

MASUMORI SHUNJI4 citations64

ASADA TOSHIAKI

1 patent
US9221130B2Dec 29, 2015

Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method

ASADA TOSHIAKI1 citations45

NISHIKUBO HIDEO

1 patent
US10177079B2Jan 8, 2019

Conductive connecting member and manufacturing method of same

NISHIKUBO HIDEO0 citations31