Inventor

SHIH YING-CHING

TW142 patents

⚠️ This page may combine multiple inventors who share the name “SHIH YING-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIH YING-CHING

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and methods of forming the same

Package structures and methods of forming the same

Integrated circuit package and method of forming same

Package structures and methods of forming the same

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Substrate interconnections having different sizes

Plurality of stacked pillar portions on a semiconductor structure

Package structures and methods of forming the same

Semiconductor structure having a dielectric layer edge covering circuit carrier

Package and method of manufacturing the same

Dummy die placement without backside chipping

Giga interposer integration through chip-on-wafer-on-substrate

Package structure including a first die and a second die and a bridge die and method of forming the package structure

Plurality of stacked pillar portions on a semiconductor structure

Underfill structure for semiconductor packages and methods of forming the same

Package of integrated circuits having a light-to-heat-conversion coating material

Integrated circuit package and method of forming same

Package structures and methods of forming the same

Semiconductor package and manufacturing method thereof

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device and manufacturing method of the same

Method of manufacturing a release film as isolation film in package

Embedded 3D interposer structure

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Semiconductor package manufacturing method

Chip packages and methods of manufacture thereof

Packaging structures and methods with a metal pillar

Semiconductor package and manufacturing method thereof

Package component, electronic device and manufacturing method thereof

Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure

Semiconductor package and manufacturing method thereof

Package structure having bridge structure for connection between semiconductor dies

Semiconductor package and manufacturing method thereof

Package structure including stacked pillar portions

Semiconductor device and manufacturing method of the same

Integrated circuit package and method of forming same

Underfill structure for semiconductor packages and methods of forming the same

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Multi-die stacking using bumps with different sizes

Packaging devices, methods of manufacture thereof, and packaging methods

IND TECH RES INST

Stacked chip structure and fabrication method thereof

Magnetic shielding package structure of a magnetic memory device

SHIH YING-CHING

Embedded 3D interposer structure

YU CHEN-HUA

Connector design for packaging integrated circuits

Shen wen-wei

Substrate interconnections having different sizes

WU WENG-JIN

Multi-die stacking using bumps with different sizes

UNIV NAT TAIWAN

Optical subassembly of optical transceiver

LIN JING-CHENG

Die-to-die gap control for semiconductor structure and method

CHEN YU-HUA

Flexible circuit structure with stretchability and method of manufacturing the same

LEE YUAN-CHANG

Flexible circuit structure