Inventor

MITANI KIYOSHI

JP61 patents

⚠️ This page may combine multiple inventors who share the name “MITANI KIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITANI KIYOSHI

SHINETSU HANDOTAI KK

Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method

Method of fabricating an SOI wafer and SOI wafer fabricated thereby

Method for reclaiming delaminated wafer and reclaimed delaminated wafer

Bonded wafer and method of producing bonded wafer

Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment

Method for manufacturing bonded wafer and bonded wafer

Method of fabricating an SOI wafer and SOI wafer fabricated by the method

Method of fabricating an SOI wafer

Method for manufacturing bonded wafer and bonded wafer manufactured thereby

Method of making bonded wafers

SOI substrate and manufacturing method therefor

Method of recycling a delaminated wafer and a silicon wafer used for the recycling

Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method

Bonded wafer and method of producing bonded wafer

Method of fabricating SOI wafer

Method for producing bonded wafer and bonded wafer

Method for producing SOI wafer and SOI wafer

Method for reclaiming delaminated wafer and reclaimed delaminated wafer

Method for manufacturing bonded wafer

Method of fabricating an SOI wafer and SOI wafer fabricated by the method

Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer

Method of fabricating bonded wafer

Method for producing bonding wafer

SOI wafers and methods for producing SOI wafer

Method for production of SOI substrate

Method of manufacturing a bonding substrate

Method of producing a bonded wafer and the bonded wafer

Method for determination of resistivity of N-type silicon epitaxial layer

Method for producing semiconductor wafer

Method of fabricating SOI wafer

SOI wafer producing method, and wafer separating jig

Production method for bonded substrates

Production method for SOI wafer and SOI wafer

Method of fabricating bonded wafer

Bonded wafer producing method and bonded wafer

Manufacturing method of bonded wafer

Method for producing SOI wafer and SOI wafer

SOI wafer and method for the preparation thereof

Method of estimating quantity of boron at bonding interface in bonded wafer

Method for producing SOI wafer and SOI wafer

SOI wafer and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Dental camera

Television camera

Speaker box

Television camera

Audio mixer

SOITEC SILICON ON INSULATOR

Method for treating substrates for microelectronics and substrates obtained by said method

SEH AMERICA

Epitaxial silicon wafers for CMOS integrated circuits

MITANI KIYOSHI

Hand riveter

SEH AMERICA INC

Method for forming epitaxial semiconductor wafer for CMOS integrated circuits