Inventor

ZANG RUEY KAE

US5 patents

⚠️ This page may combine multiple inventors who share the name “ZANG RUEY KAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

3 patents

US10321575B2Jun 11, 2019

Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components

QUALCOMM INC8 citations82

US10231324B2Mar 12, 2019

Staggered power structure in a power distribution network (PDN)

QUALCOMM INC1 citations61

US9041176B2May 26, 2015

Hybrid semiconductor module structure

QUALCOMM INC3 citations58

ZANG RUEY KAE

1 patent

US8952552B2Feb 10, 2015

Semiconductor package assembly systems and methods using DAM and trench structures

ZANG RUEY KAE20 citations86

LANE RYAN D

1 patent

US8890143B2Nov 18, 2014

Method to optimize and reduce integrated circuit, package design, and verification cycle time

LANE RYAN D0 citations30