Inventor

RAY DEWALI

US8 patents

⚠️ This page may combine multiple inventors who share the name “RAY DEWALI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

5 patents

US7989022B2Aug 2, 2011

Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto

MICRON TECHNOLOGY INC3 citations62

US11011521B2May 18, 2021

Semiconductor structure patterning

MICRON TECHNOLOGY INC1 citations59

US10020287B2Jul 10, 2018

Pass-through interconnect structure for microelectronic dies and associated systems and methods

MICRON TECHNOLOGY INC0 citations51

US8929052B2Jan 6, 2015

Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto

MICRON TECHNOLOGY INC0 citations51

US10964475B2Mar 30, 2021

Formation of a capacitor using a sacrificial layer

MICRON TECHNOLOGY INC0 citations49

PRATT DAVID S

2 patents

US8084854B2Dec 27, 2011

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

PRATT DAVID S22 citations91

US9209158B2Dec 8, 2015

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

PRATT DAVID S4 citations71

RAY DEWALI

1 patent

US8503156B2Aug 6, 2013

Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto

RAY DEWALI15 citations88