Inventor

ZBRZEZNY ADAM

PL4 patents

⚠️ This page may combine multiple inventors who share the name “ZBRZEZNY ADAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ATI TECHNOLOGIES ULC

2 patents

US8344505B2Jan 1, 2013

Wafer level packaging of semiconductor chips

ATI TECHNOLOGIES ULC13 citations81

US8785317B2Jul 22, 2014

Wafer level packaging of semiconductor chips

ATI TECHNOLOGIES ULC0 citations49

TOPACIO RODEN

2 patents

US8313984B2Nov 20, 2012

Die substrate with reinforcement structure

TOPACIO RODEN4 citations59

US8927344B2Jan 6, 2015

Die substrate with reinforcement structure

TOPACIO RODEN1 citations48