Inventor
HIROTSURU HIDEKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “HIROTSURU HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENKA COMPANY LTD
11 patentsUS10487013B2Nov 26, 2019
Ceramic resin composite body
DENKA COMPANY LTD2 citations70
US9516741B2Dec 6, 2016
Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
DENKA COMPANY LTD3 citations69
US11096278B2Aug 17, 2021
Ceramic circuit board
DENKA COMPANY LTD0 citations60
US11296008B2Apr 5, 2022
Aluminum-silicon carbide composite and production method therefor
DENKA COMPANY LTD1 citations59
US10233125B2Mar 19, 2019
Aluminium-silicon carbide composite, and power-module base plate
DENKA COMPANY LTD1 citations59
US10615096B2Apr 7, 2020
Heat dissipation structure for electric circuit device
DENKA COMPANY LTD1 citations56
US11094648B2Aug 17, 2021
Power module
DENKA COMPANY LTD0 citations50
US10377676B2Aug 13, 2019
Resin-impregnated boron nitride sintered body and use for same
DENKA COMPANY LTD0 citations45
US10087112B2Oct 2, 2018
Resin-impregnated boron nitride sintered body and use for same
DENKA COMPANY LTD0 citations45
US9879168B2Jan 30, 2018
Method for producing hexagonal boron nitride, and heat dissipation sheet
DENKA COMPANY LTD0 citations45
US10081055B2Sep 25, 2018
Composite body and method for producing same
DENKA COMPANY LTD0 citations42
DENKI KAGAKU KOGYO KK
8 patentsUS6399187B1Jun 4, 2002
Metal-ceramics composite, heat dissipation device employing it, and processes for producing them
DENKI KAGAKU KOGYO KK18 citations91
US6447894B1Sep 10, 2002
Silicon carbide composite, method for producing it and heat dissipation device employing it
DENKI KAGAKU KOGYO KK36 citations90
US7130174B2Oct 31, 2006
Integral-type ceramic circuit board and method of producing same
DENKI KAGAKU KOGYO KK14 citations83
US5126295AJun 30, 1992
Silicon nitride powder, silicon nitride sintered body and processes for their production
DENKI KAGAKU KOGYO KK9 citations68
US7207105B2Apr 24, 2007
Method for producing an integral ceramic circuit board
DENKI KAGAKU KOGYO KK2 citations62
US7993728B2Aug 9, 2011
Aluminum/silicon carbide composite and radiating part comprising the same
DENKI KAGAKU KOGYO KK3 citations60
US8025962B2Sep 27, 2011
Aluminum-silicon carbide composite and heat dissipation device employing the same
DENKI KAGAKU KOGYO KK1 citations50
US7838107B2Nov 23, 2010
Aluminum-silicon carbide composite
DENKI KAGAKU KOGYO KK0 citations32
HIROTSURU HIDEKI
6 patentsUS8883564B2Nov 11, 2014
Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member
HIROTSURU HIDEKI4 citations68
US8890189B2Nov 18, 2014
Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer
HIROTSURU HIDEKI2 citations61
US8322398B2Dec 4, 2012
Manufacturing method of aluminum-diamond composite
HIROTSURU HIDEKI4 citations61
US9524918B2Dec 20, 2016
Heat dissipating component for semiconductor element
HIROTSURU HIDEKI0 citations51
US9387532B2Jul 12, 2016
Composite substrate for LED light emitting element, method of production of same, and LED light emitting element
HIROTSURU HIDEKI0 citations51
US9017824B2Apr 28, 2015
Aluminum-diamond composite and manufacturing method
HIROTSURU HIDEKI1 citations51