Inventor
JUNG KYUNG MOON
KR20 patents
⚠️ This page may combine multiple inventors who share the name “JUNG KYUNG MOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS10790239B2Sep 29, 2020
Semiconductor package and board for mounting the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US11742308B2Aug 29, 2023
Semiconductor package for reducing stress to redistribution via
SAMSUNG ELECTRONICS CO LTD0 citations62
US10998362B2May 4, 2021
Fan-out sensor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10504855B2Dec 10, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10734342B2Aug 4, 2020
Semiconductor package for reducing stress to redistribution via
SAMSUNG ELECTRONICS CO LTD0 citations52
US10714440B2Jul 14, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10403588B2Sep 3, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10700110B2Jun 30, 2020
Fan-out sensor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US10396049B2Aug 27, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US7915428B2Mar 29, 2011
Photorefractive dendron compound, photorefractive dendrimer compound, method of preparing the same, photorefractive device using the same, and method of manufacturing the device
SAMSUNG ELECTRONICS CO LTD0 citations49
US11244921B2Feb 8, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
SAMSUNG ELECTRO MECH
7 patentsUS9935068B2Apr 3, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH6 citations81
US11081283B2Aug 3, 2021
Multi-layered ceramic electronic component and mounting board thereof
SAMSUNG ELECTRO MECH0 citations62
US10887983B2Jan 5, 2021
Printed circuit board
SAMSUNG ELECTRO MECH0 citations61
US10032697B2Jul 24, 2018
Electronic component package and electronic device including the same
SAMSUNG ELECTRO MECH1 citations52
US12573560B2Mar 10, 2026
Composite electronic component
SAMSUNG ELECTRO MECH0 citations51
US12260994B2Mar 25, 2025
Composite electronic component with electrode using epoxy
SAMSUNG ELECTRO MECH0 citations50
US12183515B2Dec 31, 2024
Ceramic electronic component
SAMSUNG ELECTRO MECH0 citations50