Inventor
SAMADI KAMBIZ
US17 patents
Patents
17 patentsUS10121743B2Nov 6, 2018
Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)
QUALCOMM INC31 citations94
US9754923B1Sep 5, 2017
Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)
QUALCOMM INC30 citations94
US9147438B2Sep 29, 2015
Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods
QUALCOMM INC7 citations83
US9741691B2Aug 22, 2017
Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)
QUALCOMM INC14 citations82
US9098666B2Aug 4, 2015
Clock distribution network for 3D integrated circuit
QUALCOMM INC8 citations82
US10176147B2Jan 8, 2019
Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods
QUALCOMM INC5 citations72
US9629233B2Apr 18, 2017
Techniques for implementing a synthetic jet to cool a device
QUALCOMM INC4 citations72
US10192813B2Jan 29, 2019
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
QUALCOMM INC1 citations71
US9123721B2Sep 1, 2015
Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace
QUALCOMM INC5 citations71
US9064077B2Jun 23, 2015
3D floorplanning using 2D and 3D blocks
QUALCOMM INC5 citations70
US10510651B2Dec 17, 2019
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
QUALCOMM INC1 citations69
US9041448B2May 26, 2015
Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
QUALCOMM INC3 citations62
US9483598B2Nov 1, 2016
Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits
QUALCOMM INC2 citations61
US11004780B2May 11, 2021
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
QUALCOMM INC0 citations58
US9508615B2Nov 29, 2016
Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits
QUALCOMM INC1 citations51
US9929733B1Mar 27, 2018
Connection propagation for inter-logical block connections in integrated circuits
QUALCOMM INC0 citations41
US9626311B2Apr 18, 2017
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
QUALCOMM INC0 citations35