P

Inventor

CHEN XIANMING

CN91 patents
⚠️ This page may combine multiple inventors who share the name “CHEN XIANMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZTE CORP

25 patents
US9425928B2Aug 23, 2016

Data transmission method and device

ZTE CORP7 citations84
US11770859B2Sep 26, 2023

Information transmission method, and base station, terminal and computer-readable storage medium

ZTE CORP2 citations73
US11381434B2Jul 5, 2022

Signal transmitting method, device and system, and storage medium

ZTE CORP2 citations73
US11356215B2Jun 7, 2022

System and method for transmitting a signal

ZTE CORP2 citations73
US11284446B2Mar 22, 2022

Information transmission method, and base station, terminal and computer-readable storage medium

ZTE CORP2 citations73
US11201776B2Dec 14, 2021

System and method for transmitting a signal

ZTE CORP2 citations73
US11057899B2Jul 6, 2021

Method and apparatus for resource allocation and determination

ZTE CORP2 citations73
US10952033B2Mar 16, 2021

Multicast transmission method and apparatus, and computer storage medium

ZTE CORP5 citations73
US10862530B2Dec 8, 2020

Method and device for transmitting positioning reference signal, and computer storage medium

ZTE CORP6 citations73
US10554367B2Feb 4, 2020

Narrowband uplink resource configuration

ZTE CORP3 citations73
US10433341B2Oct 1, 2019

Random access response message sending method and node

ZTE CORP4 citations73
US9781739B2Oct 3, 2017

Method, base station, terminal and system for system information transmission

ZTE CORP2 citations73
US12166700B2Dec 10, 2024

System and method for transmitting a signal

ZTE CORP0 citations63
US11924012B2Mar 5, 2024

Signal transmitting method, device, and storage medium

ZTE CORP0 citations63
US11882536B2Jan 23, 2024

System and method for transmitting a signal

ZTE CORP0 citations63
US11743902B2Aug 29, 2023

Information transmission method and apparatus

ZTE CORP0 citations63
US11722854B2Aug 8, 2023

Multicast transmission method and apparatus, and computer storage medium

ZTE CORP0 citations63
US11689333B2Jun 27, 2023

Signal transmission method and system

ZTE CORP0 citations63
US11382089B2Jul 5, 2022

Information transmission method and device, storage medium and electronic device

ZTE CORP0 citations63
US11115252B2Sep 7, 2021

Signal transmission method and system

ZTE CORP0 citations63
US10666484B2May 26, 2020

Method and apparatus for transmission of synchronization signal

ZTE CORP1 citations63
US10455448B2Oct 22, 2019

Random access signalling resending method and apparatus

ZTE CORP1 citations63
US10448430B2Oct 15, 2019

Group based random access method device and system

ZTE CORP1 citations63
US11653364B2May 16, 2023

Methods and apparatus for configuring a scheduling request

ZTE CORP0 citations52
US11595166B2Feb 28, 2023

Data transmission method and apparatus

ZTE CORP0 citations52

ZHUHAI ACCESS SEMICONDUCTOR CO LTD

19 patents
US12302508B2May 13, 2025

Temporary carrier and method for manufacturing coreless substrate thereby

ZHUHAI ACCESS SEMICONDUCTOR CO LTD2 citations72
US11114310B1Sep 7, 2021

Embedded packaging method capable of realizing heat dissipation

ZHUHAI ACCESS SEMICONDUCTOR CO LTD4 citations70
US12040272B2Jul 16, 2024

Connector for implementing multi-faceted interconnection

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11984414B2May 14, 2024

Packaging structure with antenna and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11769733B2Sep 26, 2023

Package substrate

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11682621B2Jun 20, 2023

Connector for implementing multi-faceted interconnection

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11515258B2Nov 29, 2022

Package substrate and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11503712B2Nov 15, 2022

Passive device packaging structure embedded in glass medium and method for manufacturing the same

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US12148676B2Nov 19, 2024

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US12040526B2Jul 16, 2024

Method for manufacturing embedded package structure having air resonant cavity

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11854920B2Dec 26, 2023

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11257713B2Feb 22, 2022

Interposer board without feature layer structure and method for manufacturing the same

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11822121B2Nov 21, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11579362B2Feb 14, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11450619B2Sep 20, 2022

Embedded packaging structure having shielding cavity and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11399440B2Jul 26, 2022

Method for manufacturing coreless substrate

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US12412843B2Sep 9, 2025

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12002734B2Jun 4, 2024

Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US11569177B2Jan 31, 2023

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58

XIAN ZHONGXING NEW SOFTWARE CO LTD

5 patents

UNIV ELECTRONIC SCI & TECH CHINA

1 patent

Showing the top 50 of 91 patents by PatentIndex Score.