Inventor

NAGATO MASAYA

JP12 patents

⚠️ This page may combine multiple inventors who share the name “NAGATO MASAYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

6 patents

US11527402B2Dec 13, 2022

Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP4 citations71

US11978623B2May 7, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations61

US12424437B2Sep 23, 2025

Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations60

US11961733B2Apr 16, 2024

Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP1 citations60

US10968517B2Apr 6, 2021

Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations58

US12371782B2Jul 29, 2025

Method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations46

HITACHI INT ELECTRIC INC

6 patents

US10156012B2Dec 18, 2018

Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and a non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC3 citations71

US12094708B2Sep 17, 2024

Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC0 citations61

US10096463B2Oct 9, 2018

Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording medium

HITACHI INT ELECTRIC INC1 citations50

US9976214B2May 22, 2018

Cleaning method and method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC0 citations50

US10910214B2Feb 2, 2021

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

HITACHI INT ELECTRIC INC0 citations47

US10586698B2Mar 10, 2020

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

HITACHI INT ELECTRIC INC0 citations41