Inventor
KAMEDA KENJI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “KAMEDA KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
10 patentsUS9028648B1May 12, 2015
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC9 citations84
US9587308B2Mar 7, 2017
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC2 citations72
US10156012B2Dec 18, 2018
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and a non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC3 citations71
US9540727B2Jan 10, 2017
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC2 citations69
US11735412B2Aug 22, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations62
US10724137B2Jul 28, 2020
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and cleaning completion determining method
HITACHI INT ELECTRIC INC1 citations62
US11001923B2May 11, 2021
Method of manufacturing semiconductor device and recording medium
HITACHI INT ELECTRIC INC0 citations51
US10176988B2Jan 8, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations50
US9976214B2May 22, 2018
Cleaning method and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations50
US9683288B2Jun 20, 2017
Method of manufacturing semiconductor device and method of cleaning processing vessel
HITACHI INT ELECTRIC INC1 citations48
KOKUSAI ELECTRIC CORP
7 patentsUS11094532B2Aug 17, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US10968517B2Apr 6, 2021
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations58
US11705326B2Jul 18, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US10804100B2Oct 13, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US11515152B2Nov 29, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrate
KOKUSAI ELECTRIC CORP0 citations49
KAMEDA KENJI
4 patentsUS8115764B2Feb 14, 2012
Map display system, map data processing apparatus, map display apparatus, and map display method
KAMEDA KENJI32 citations89
US9856560B2Jan 2, 2018
Method for manufacturing semiconductor device and substrate processing apparatus
KAMEDA KENJI2 citations71
US8741783B2Jun 3, 2014
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and recording medium
KAMEDA KENJI5 citations71
US8679259B2Mar 25, 2014
Substrate processing apparatus, method of manufacturing semiconductor device and method of cleaning processing vessel
KAMEDA KENJI2 citations58
SONY CORP
3 patentsUS7047021B2May 16, 2006
Communication system
SONY CORP11 citations83
US7612777B2Nov 3, 2009
Animation generating apparatus, animation generating method, and animation generating program
SONY CORP13 citations82
US7177482B2Feb 13, 2007
Boundary line detection apparatus and method, and image processing apparatus and method as well as recording medium
SONY CORP7 citations73
JAPAN AVIATION ELECTRONICS IND LTD
3 patentsUS10998647B2May 4, 2021
Harness with a wire terminal
JAPAN AVIATION ELECTRONICS IND LTD1 citations62
US11616334B2Mar 28, 2023
Method of manufacturing cable assembly, horn chip used in the method and cable assembly manufactured by the method
JAPAN AVIATION ELECTRONICS IND LTD0 citations52
US11398686B2Jul 26, 2022
Wire, wire with terminal, harness, manufacturing method for wire, and manufacturing method for wire with terminal
JAPAN AVIATION ELECTRONICS IND LTD0 citations51