Inventor
BALASUBRAMANIAN GANESH
US107 patents
⚠️ This page may combine multiple inventors who share the name “BALASUBRAMANIAN GANESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
43 patentsUS9157730B2Oct 13, 2015
PECVD process
APPLIED MATERIALS INC49 citations97
US9355876B2May 31, 2016
Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations
APPLIED MATERIALS INC452 citations95
US7166544B2Jan 23, 2007
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
APPLIED MATERIALS INC20 citations93
US9816187B2Nov 14, 2017
PECVD process
APPLIED MATERIALS INC8 citations92
US9458537B2Oct 4, 2016
PECVD process
APPLIED MATERIALS INC12 citations92
US7829145B2Nov 9, 2010
Methods of uniformity control for low flow process and chamber to chamber matching
APPLIED MATERIALS INC18 citations92
US7622005B2Nov 24, 2009
Uniformity control for low flow process and chamber to chamber matching
APPLIED MATERIALS INC19 citations92
US7572337B2Aug 11, 2009
Blocker plate bypass to distribute gases in a chemical vapor deposition system
APPLIED MATERIALS INC43 citations92
US10793954B2Oct 6, 2020
PECVD process
APPLIED MATERIALS INC3 citations84
US10060032B2Aug 28, 2018
PECVD process
APPLIED MATERIALS INC3 citations84
US7867578B2Jan 11, 2011
Method for depositing an amorphous carbon film with improved density and step coverage
APPLIED MATERIALS INC12 citations84
US10403535B2Sep 3, 2019
Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
APPLIED MATERIALS INC11 citations83
US9390910B2Jul 12, 2016
Gas flow profile modulated control of overlay in plasma CVD films
APPLIED MATERIALS INC5 citations83
US7259111B2Aug 21, 2007
Interface engineering to improve adhesion between low k stacks
APPLIED MATERIALS INC14 citations83
US7189658B2Mar 13, 2007
Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile
APPLIED MATERIALS INC11 citations82
US11670492B2Jun 6, 2023
Chamber configurations and processes for particle control
APPLIED MATERIALS INC5 citations74
US11613812B2Mar 28, 2023
PECVD process
APPLIED MATERIALS INC2 citations73
US10636630B2Apr 28, 2020
Processing chamber and method with thermal control
APPLIED MATERIALS INC2 citations73
US10128118B2Nov 13, 2018
Bottom and side plasma tuning having closed loop control
APPLIED MATERIALS INC2 citations73
US10748797B2Aug 18, 2020
Plasma parameters and skew characterization by high speed imaging
APPLIED MATERIALS INC2 citations72
US10580623B2Mar 3, 2020
Plasma processing using multiple radio frequency power feeds for improved uniformity
APPLIED MATERIALS INC3 citations72
US10373822B2Aug 6, 2019
Gas flow profile modulated control of overlay in plasma CVD films
APPLIED MATERIALS INC2 citations72
US9922819B2Mar 20, 2018
Wafer rotation in a semiconductor chamber
APPLIED MATERIALS INC2 citations72
US11069514B2Jul 20, 2021
Remote capacitively coupled plasma source with improved ion blocker
APPLIED MATERIALS INC3 citations71
US11031262B2Jun 8, 2021
Loadlock integrated bevel etcher system
APPLIED MATERIALS INC2 citations71
US10636684B2Apr 28, 2020
Loadlock integrated bevel etcher system
APPLIED MATERIALS INC1 citations71
US10403515B2Sep 3, 2019
Loadlock integrated bevel etcher system
APPLIED MATERIALS INC1 citations71
US10276353B2Apr 30, 2019
Dual-channel showerhead for formation of film stacks
APPLIED MATERIALS INC4 citations71
US10100408B2Oct 16, 2018
Edge hump reduction faceplate by plasma modulation
APPLIED MATERIALS INC6 citations71
US9593419B2Mar 14, 2017
Wafer rotation in a semiconductor chamber
APPLIED MATERIALS INC2 citations71
US11721545B2Aug 8, 2023
Method of using dual frequency RF power in a process chamber
APPLIED MATERIALS INC2 citations70
US11592812B2Feb 28, 2023
Sensor metrology data integration
APPLIED MATERIALS INC2 citations70
US11488811B2Nov 1, 2022
Chucking process and system for substrate processing chambers
APPLIED MATERIALS INC2 citations70
US10600624B2Mar 24, 2020
System and method for substrate processing chambers
APPLIED MATERIALS INC5 citations70
US10094486B2Oct 9, 2018
Method and system for supplying a cleaning gas into a process chamber
APPLIED MATERIALS INC1 citations63
US7922440B2Apr 12, 2011
Apparatus and method for centering a substrate in a process chamber
APPLIED MATERIALS INC6 citations63
US7514125B2Apr 7, 2009
Methods to improve the in-film defectivity of PECVD amorphous carbon films
APPLIED MATERIALS INC2 citations63
US12400843B2Aug 26, 2025
Chamber configurations and processes for particle control
APPLIED MATERIALS INC0 citations62
US11898249B2Feb 13, 2024
PECVD process
APPLIED MATERIALS INC0 citations62
US11875969B2Jan 16, 2024
Process chamber with reduced plasma arc
APPLIED MATERIALS INC0 citations62
US11276562B2Mar 15, 2022
Plasma processing using multiple radio frequency power feeds for improved uniformity
APPLIED MATERIALS INC0 citations62
US11133210B2Sep 28, 2021
Dual temperature heater
APPLIED MATERIALS INC0 citations62
US10910227B2Feb 2, 2021
Bottom and side plasma tuning having closed loop control
APPLIED MATERIALS INC0 citations62
BANK OF AMERICA
2 patentsSHAH ASHISH
1 patentPADHI DEENESH
1 patentSANKARAKRISHNAN RAMPRAKASH
1 patentDU BOIS DALE R
1 patentSCHLUMBERGER TECHNOLOGY CORP
1 patentShowing the top 50 of 107 patents by PatentIndex Score.