Inventor
KURODA HIROFUMI
JP21 patents
⚠️ This page may combine multiple inventors who share the name “KURODA HIROFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO BAKELITE CO
6 patentsUS7696286B2Apr 13, 2010
Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
SUMITOMO BAKELITE CO11 citations83
US7157313B2Jan 2, 2007
Epoxy resin composition and semiconductor device using thereof
SUMITOMO BAKELITE CO8 citations73
US7431990B2Oct 7, 2008
Resin composition for encapsulating semiconductor chip and semiconductor device therewith
SUMITOMO BAKELITE CO2 citations62
US7671146B2Mar 2, 2010
Epoxy resin composition for encapsulating semiconductor and semiconductor device
SUMITOMO BAKELITE CO3 citations59
US7956136B2Jun 7, 2011
Resin composition for semiconductor encapsulation and semiconductor device
SUMITOMO BAKELITE CO1 citations51
US7470754B2Dec 30, 2008
Biphenylaralkyl epoxy and phenolic resins
SUMITOMO BAKELITE CO0 citations38
EISAI R&D MAN CO LTD
5 patentsUS10259791B2Apr 16, 2019
High-purity quinoline derivative and method for manufacturing same
EISAI R&D MAN CO LTD13 citations91
US10822307B2Nov 3, 2020
High-purity quinoline derivative and method for manufacturing same
EISAI R&D MAN CO LTD10 citations82
US10407393B2Sep 10, 2019
High-purity quinoline derivative and method for manufacturing same
EISAI R&D MAN CO LTD9 citations82
US11186547B2Nov 30, 2021
High-purity quinoline derivative and method for manufacturing same
EISAI R&D MAN CO LTD0 citations61
US11691990B2Jul 4, 2023
Salts of compounds and crystals thereof
EISAI R&D MAN CO LTD0 citations58