Inventor

VUKKADALA PRADEEP

US26 patents

⚠️ This page may combine multiple inventors who share the name “VUKKADALA PRADEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VUKKADALA PRADEEP

KLA TENCOR CORP

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking

Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements

System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking

Process-induced displacement characterization during semiconductor production

Prediction based chucking and lithography control optimization

Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool

Predictive wafer modeling based focus error prediction using correlations of wafers

Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool

Systems and methods of advanced site-based nanotopography for wafer surface metrology

Overlay and semiconductor process control using a wafer geometry metric

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

Using wafer geometry to improve scanner correction effectiveness for overlay control

Patterned wafer geometry measurements for semiconductor process controls

Prediction based chucking and lithography control optimization

Using wafer geometry to improve scanner correction effectiveness for overlay control

Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performance

Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sections

Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry

KLA CORP

Lithography mask repair by simulation of photoresist thickness evolution

Process-induced displacement characterization during semiconductor production

Prediction and metrology of stochastic photoresist thickness defects

Method to calibrate, predict, and control stochastic defects in EUV lithography

Method to calibrate, predict, and control stochastic defects in EUV lithography

Method to calibrate, predict, and control stochastic defects in EUV lithography

VUKKADALA PRADEEP

Overlay and semiconductor process control using a wafer geometry metric