P

Inventor

SHIN HWA-SEON

KR26 patents
⚠️ This page may combine multiple inventors who share the name “SHIN HWA-SEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOREA ELECTRONICS TECHNOLOGY

16 patents
USRE47897EMar 3, 2020

Method for image prediction of multi-view video codec and computer readable recording medium therefor

KOREA ELECTRONICS TECHNOLOGY1 citations62
US9438882B2Sep 6, 2016

Method for image prediction of multi-view video codec and computer readable recording medium therefor

KOREA ELECTRONICS TECHNOLOGY2 citations62
US11798231B2Oct 24, 2023

Method for generating hollow structure based on 2D laminated cross-sectional outline for 3D printing

KOREA ELECTRONICS TECHNOLOGY0 citations59
US11613082B2Mar 28, 2023

Method for producing 3D mesh surface characteristic-based support for laminate manufacturing

KOREA ELECTRONICS TECHNOLOGY0 citations59
US12220921B2Feb 11, 2025

Nozzle clogging defect compensating method for binder jetting stack manufacturing means

KOREA ELECTRONICS TECHNOLOGY0 citations56
US9288467B2Mar 15, 2016

Method for providing and recognizing transmission mode in digital broadcasting

KOREA ELECTRONICS TECHNOLOGY0 citations52
US9466312B2Oct 11, 2016

Method for separating audio sources and audio system using the same

KOREA ELECTRONICS TECHNOLOGY0 citations51
US9635344B2Apr 25, 2017

Method for service compatibility-type transmitting in digital broadcast

KOREA ELECTRONICS TECHNOLOGY0 citations50
US9204124B2Dec 1, 2015

Method for service compatibility-type transmitting in digital broadcast

KOREA ELECTRONICS TECHNOLOGY0 citations50
US12400412B2Aug 26, 2025

Method for modifying design on basis of additive cross-section outline for 3D printing

KOREA ELECTRONICS TECHNOLOGY0 citations49
US12233601B2Feb 25, 2025

Method for creating 2D slicing polyline based support structure for 3D printing

KOREA ELECTRONICS TECHNOLOGY0 citations49
US12202206B2Jan 21, 2025

3D printing slicing method for solving tolerance problem

KOREA ELECTRONICS TECHNOLOGY0 citations49
US11548227B2Jan 10, 2023

Method for monitoring 3D printing equipped with 3D printing slicer and recursive loop structure

KOREA ELECTRONICS TECHNOLOGY0 citations49
US10176583B2Jan 8, 2019

Topological derivative-based image segmentation method and system with heterogeneous image features

KOREA ELECTRONICS TECHNOLOGY0 citations49
US12350886B2Jul 8, 2025

3D printing slicing method for solving quantization error problem

KOREA ELECTRONICS TECHNOLOGY0 citations48
US10489675B2Nov 26, 2019

Robust region segmentation method and system using the same

KOREA ELECTRONICS TECHNOLOGY0 citations38

CHOI BYEONG HO

5 patents

PARK JI HO

2 patents

SHIN HWA SEON

1 patent

KIM HYUN GYU

1 patent

KIM GOO-HYUN

1 patent