Inventor
TAKASAWA YUSHIN
JP44 patents
⚠️ This page may combine multiple inventors who share the name “TAKASAWA YUSHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
24 patentsUS10026607B2Jul 17, 2018
Substrate processing apparatus for forming film including at least two different elements
HITACHI INT ELECTRIC INC8 citations92
US9312123B2Apr 12, 2016
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC6 citations92
US7884034B2Feb 8, 2011
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC20 citations89
US9385013B2Jul 5, 2016
Method and apparatus of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9384972B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9384968B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9384971B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC5 citations84
US9330904B2May 3, 2016
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations84
US8809204B2Aug 19, 2014
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC4 citations84
US9384967B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384969B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384970B2Jul 5, 2016
Method of manufacturing semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9384966B2Jul 5, 2016
Method of manufacturing a semiconductor device by forming a film on a substrate
HITACHI INT ELECTRIC INC2 citations74
US9455137B2Sep 27, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC3 citations73
US9334567B2May 10, 2016
Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatus
HITACHI INT ELECTRIC INC3 citations73
US10720325B2Jul 21, 2020
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC3 citations72
US9269566B2Feb 23, 2016
Substrate processing apparatus
HITACHI INT ELECTRIC INC1 citations63
US9217199B2Dec 22, 2015
Substrate processing apparatus
HITACHI INT ELECTRIC INC1 citations63
US9011601B2Apr 21, 2015
Substrate processing apparatus
HITACHI INT ELECTRIC INC2 citations63
US8946092B2Feb 3, 2015
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
HITACHI INT ELECTRIC INC2 citations63
US11735412B2Aug 22, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations62
US6821871B2Nov 23, 2004
Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatus
HITACHI INT ELECTRIC INC1 citations51
US10290492B2May 14, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations50
US10586698B2Mar 10, 2020
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC0 citations41
HITACHI-KOKUSAI ELECTRIC INC
4 patentsUS9443720B2Sep 13, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC6 citations92
US9487861B2Nov 8, 2016
Substrate processing apparatus capable of forming films including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
US9478417B2Oct 25, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
US9443719B2Sep 13, 2016
Method of manufacturing semiconductor device for forming film including at least two different elements
HITACHI-KOKUSAI ELECTRIC INC4 citations83
TAKASAWA YUSHIN
3 patentsUS9318316B2Apr 19, 2016
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elements
TAKASAWA YUSHIN7 citations91
US8409988B2Apr 2, 2013
Method of manufacturing semiconductor device and substrate processing apparatus
TAKASAWA YUSHIN4 citations61
US8410001B2Apr 2, 2013
Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatus
TAKASAWA YUSHIN3 citations61
HIROSE YOSHIRO
3 patentsUS9018104B2Apr 28, 2015
Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatus
HIROSE YOSHIRO8 citations83
US8546272B2Oct 1, 2013
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
HIROSE YOSHIRO6 citations83
US9378943B2Jun 28, 2016
Method of manufacturing semiconductor device, method of processing substrate substrate processing apparatus and non-transitory computer-readable recording medium
HIROSE YOSHIRO1 citations51
OTA YOSUKE
3 patentsUS8202809B2Jun 19, 2012
Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatus
OTA YOSUKE6 citations72
US8410003B2Apr 2, 2013
Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatus
OTA YOSUKE3 citations57
US9196473B2Nov 24, 2015
Method of manufacturing an oxynitride film for a semiconductor device
OTA YOSUKE0 citations41
AKAE NAONORI
2 patentsUS8415258B2Apr 9, 2013
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
AKAE NAONORI480 citations98
US8076251B2Dec 13, 2011
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
AKAE NAONORI489 citations98