Inventor

BYRD KEVIN

US4 patents

⚠️ This page may combine multiple inventors who share the name “BYRD KEVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

2 patents

US10548249B2Jan 28, 2020

Shielding in electronic assemblies

INTEL CORP10 citations73

US12341121B2Jun 24, 2025

Through-substrate underfill formation for an integrated circuit assembly

INTEL CORP0 citations50

PIDWERBECKI DAVID

1 patent

US10305529B2May 28, 2019

Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

PIDWERBECKI DAVID1 citations56

FORD MOTOR CO

1 patent

US10682692B2Jun 16, 2020

Method for providing preformed internal features, passages, and machining clearances for over-molded inserts

FORD MOTOR CO0 citations43