Inventor

WU KAI-CHIANG

TW175 patents

⚠️ This page may combine multiple inventors who share the name “WU KAI-CHIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU KAI-CHIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated devices in semiconductor packages and methods of forming same

Method for forming package-on-package structure

Package structure and manufacturing method thereof

Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same

Methods of forming semiconductor packages having a die with an encapsulant

Package structure and manufacturing method thereof

Electronic device and manufacturing method thereof

Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

EMI Shielding structure in InFO package

Integrated fan-out package having multi-band antenna and method of forming the same

Packaged semiconductor devices and packaging methods

Semiconductor device and manufacturing method thereof

Methods and apparatus for package with interposers

Package structure and method for manufacturing thereof

Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface

Barrier structures between external electrical connectors

Semiconductor device having a guard ring

Method for singulating packaged integrated circuits and resulting structures

Semiconductor structure and manufacturing method thereof

Package structure and method of fabricating the same

Methods and apparatus for package with interposers

Semiconductor packages having a die, an encapsulant, and a redistribution structure

Package structure and method of manufacturing the same

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and fabricating method thereof

Semiconductor packages and forming methods thereof

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Package structure and fabricating method thereof

Package structure and method of manufacturing the same

Packaged semiconductor devices and packaging methods

Methods and apparatus for package with interposers

Surface mounting semiconductor components

Semiconductor package and manufacturing method thereof

Semiconductor package structure

Integrated devices in semiconductor packages and methods of forming same

EMI shielding structure in InFO package

Semiconductor structure and manufacturing method thereof

Semiconductor packages having thermal through vias (TTV)

TAIWAN SEMICONDUCTOR MFG

Polymer layers embedded with metal pads for heat dissipation

Packaging devices and methods

Methods and apparatus for package with interposers

Semiconductor devices and methods of manufacture thereof

YU CHEN-HUA

Multiple die packaging interposer structure and method

CHEN YU-FENG

Crack stopper on under-bump metallization layer

GLOBAL ADVANCED PACKAGING TECH

Structure of gold fingers

LIU MING-KAI

Methods and apparatus for package on package devices

VATE TECHNOLOGY CO LTD

Stacked chip scale package structure

TAIWAN SEMIDONDUCTOR MFG COMPANY LTD

Methods and apparatus for package with interposers