Inventor

WANG YEN-PING

TW78 patents

⚠️ This page may combine multiple inventors who share the name “WANG YEN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG YEN-PING

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and manufacturing method thereof

Methods and apparatus for package with interposers

Package structure and method for manufacturing thereof

Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface

Method for singulating packaged integrated circuits and resulting structures

Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Methods and apparatus for package with interposers

Semiconductor packages and forming methods thereof

Methods and apparatus for package with interposers

Surface mounting semiconductor components

Methods and apparatus for package with interposers

Semiconductor device

Integrated fan-out package

Method for singulating packaged integrated circuits and resulting structures

Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor packaging and manufacturing method thereof

Semiconductor devices and methods of manufacturing

Semiconductor packages and forming methods thereof

Manufacturing method of a semiconductor device

Methods of manufacturing a semiconductor device including a joint adjacent to a post

Integrated fan-out package and manufacturing method thereof

Semiconductor devices and methods of manufacturing

Package structure and manufacturing method thereof

Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Integrated fan-out package and manufacturing method thereof

Semiconductor device

Interconnection structure including a metal post encapsulated by a joint material having concave outer surface

Method for singulating packaged integrated circuits and resulting structures

Semiconductor device and manufacturing method thereof

Semiconductor packaging and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG

Semiconductor device and method of manufacturing the same

Strained channel transistor formation

PMOS transistor with discontinuous CESL and method of fabrication

Ultra shallow junction formation by solid phase diffusion

Semiconductor device

Dual work function gate electrodes

Singulated semiconductor structure

Partial replacement silicide gate

Selective doping and thermal annealing method for forming a gate electrode pair with different work functions

GRENERGY OPTO INC

Active-load dominant circuit for common-mode glitch interference cancellation

WANG YEN-PING

Pulse filter and bridge driver using the same

TAIWAN SEMIDONDUCTOR MFG COMPANY LTD

Methods and apparatus for package with interposers

IND TECH RES INST

Ferrite with high permeability and high dielectric constant and method for making the same

WANG CHIH-HAO

Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same

CHANG CHIANG-CHENG

Package substrate having landless conductive traces