Inventor

LIANG SHIH-WEI

TW82 patents

⚠️ This page may combine multiple inventors who share the name “LIANG SHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIANG SHIH-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit structure and seal ring structure

Integrated fan-out (InFO) package structures and methods of forming same

Dual-mode wireless charging device

Methods and apparatus for package with interposers

Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface

Barrier structures between external electrical connectors

Semiconductor structure and manufacturing method thereof

Methods and apparatus for package with interposers

Methods and apparatus for package with interposers

Surface mounting semiconductor components

Methods and apparatus for package with interposers

Method for manufacturing semiconductor structure

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Packaging devices and methods

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor packaging and manufacturing method thereof

MIM capacitor and method forming the same

Conductive terminal on integrated circuit

Package structures having height-adjusted molding members and methods of forming the same

Integrated circuit package and method

Dual-mode wireless charging device

Methods of manufacturing a semiconductor device including a joint adjacent to a post

Dual-mode wireless charging device

Methods and apparatus for package on package devices

Interconnection structure including a metal post encapsulated by a joint material having concave outer surface

Solder ball protection in packages

Semiconductor packaging and manufacturing method thereof

Electrical connections for chip scale packaging

Semiconductor devices with ball strength improvement

Polymer layers embedded with metal pads for heat dissipation

TAIWAN SEMICONDUCTOR MFG

Electrical connections for chip scale packaging

Semiconductor device and method of manufacturing the same

Polymer layers embedded with metal pads for heat dissipation

Packaging devices and methods

Method of making a semiconductor device having a post-passivation interconnect structure

Chip package and method of manufacturing the same

Methods and apparatus for package on package devices

Semiconductor device

Singulated semiconductor structure

CHEN HSIEN-WEI

Electrical connections for chip scale packaging

Probe pad on a corner stress relief region in a semiconductor chip

LIANG SHIH-WEI

Post-passivation interconnect structure

Integrated circuit with test circuit

YANG CHUNG-YING

Wafer level chip scale package and method of manufacturing the same

SHAO TUNG-LIANG

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

LIU MING-KAI

Methods and apparatus for package on package devices

TAIWAN SEMIDONDUCTOR MFG COMPANY LTD

Methods and apparatus for package with interposers

CHEN YING-JU

Bond pad structure to reduce bond pad corrosion

MICRON TECHNOLOGY INC

Techniques for forming semiconductor device packages and related packages, intermediate products, and methods