Inventor
YANG CHING-FENG
TW46 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHING-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
42 patentsUS9412661B2Aug 9, 2016
Method for forming package-on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD50 citations94
US10468355B2Nov 5, 2019
EMI Shielding structure in InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US10312112B2Jun 4, 2019
Integrated fan-out package having multi-band antenna and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10043761B2Aug 7, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9966321B2May 8, 2018
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9806045B2Oct 31, 2017
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9659879B1May 23, 2017
Semiconductor device having a guard ring
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9543373B2Jan 10, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US12322670B2Jun 3, 2025
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations75
US11574857B2Feb 7, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11114357B2Sep 7, 2021
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11101238B2Aug 24, 2021
Surface mounting semiconductor components
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11018083B2May 25, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10950556B2Mar 16, 2021
EMI shielding structure in InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748831B2Aug 18, 2020
Semiconductor packages having thermal through vias (TTV)
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10522437B2Dec 31, 2019
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10510681B2Dec 17, 2019
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10157900B2Dec 18, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9559071B2Jan 31, 2017
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9543263B2Jan 10, 2017
Semiconductor packaging and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12046480B2Jul 23, 2024
Manufacturing method of a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11894330B2Feb 6, 2024
Methods of manufacturing a semiconductor device including a joint adjacent to a post
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11211339B2Dec 28, 2021
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10971463B2Apr 6, 2021
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10727082B2Jul 28, 2020
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9953942B2Apr 24, 2018
Semiconductor packaging and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12412852B2Sep 9, 2025
Polymer layers embedded with metal pads for heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12131986B2Oct 29, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11658105B2May 23, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11398440B2Jul 26, 2022
Polymer layers embedded with metal pads for heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11373922B2Jun 28, 2022
Semiconductor packages having thermal through vias (TTV)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11233019B2Jan 25, 2022
Manufacturing method of semicondcutor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867957B2Dec 15, 2020
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10622222B2Apr 14, 2020
Integrated fan-out package having multi-band antenna and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10312209B2Jun 4, 2019
Manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269588B2Apr 23, 2019
Integrated circuit underfill scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163846B2Dec 25, 2018
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10109605B2Oct 23, 2018
Polymer layers embedded with metal pads for heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941240B2Apr 10, 2018
Semiconductor chip scale package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10720399B2Jul 21, 2020
Semicondcutor package and manufacturing method of semicondcutor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9653341B2May 16, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9627325B2Apr 18, 2017
Package alignment structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42