Inventor
HUA ZHONG QIANG
US26 patents
⚠️ This page may combine multiple inventors who share the name “HUA ZHONG QIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS6372291B1Apr 16, 2002
In situ deposition and integration of silicon nitride in a high density plasma reactor
APPLIED MATERIALS INC147 citations99
US7967913B2Jun 28, 2011
Remote plasma clean process with cycled high and low pressure clean steps
APPLIED MATERIALS INC477 citations98
US7159597B2Jan 9, 2007
Multistep remote plasma clean process
APPLIED MATERIALS INC19 citations92
US7789993B2Sep 7, 2010
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC8 citations84
US7572647B2Aug 11, 2009
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC10 citations84
US7141138B2Nov 28, 2006
Gas delivery system for semiconductor processing
APPLIED MATERIALS INC13 citations83
US6812153B2Nov 2, 2004
Method for high aspect ratio HDP CVD gapfill
APPLIED MATERIALS INC13 citations83
US6822185B2Nov 23, 2004
Temperature controlled dome-coil system for high power inductively coupled plasma systems
APPLIED MATERIALS INC7 citations73
US11114306B2Sep 7, 2021
Methods for depositing dielectric material
APPLIED MATERIALS INC3 citations72
US11289312B2Mar 29, 2022
Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability
APPLIED MATERIALS INC4 citations71
US11049701B2Jun 29, 2021
Biased cover ring for a substrate processing system
APPLIED MATERIALS INC3 citations70
US7704897B2Apr 27, 2010
HDP-CVD SiON films for gap-fill
APPLIED MATERIALS INC7 citations68
US11631591B2Apr 18, 2023
Methods for depositing dielectric material
APPLIED MATERIALS INC0 citations61
US7064077B2Jun 20, 2006
Method for high aspect ratio HDP CVD gapfill
APPLIED MATERIALS INC2 citations61
US10128337B2Nov 13, 2018
Methods for forming fin structures with desired profile for 3D structure semiconductor applications
APPLIED MATERIALS INC1 citations52
US10570506B2Feb 25, 2020
Method to improve film quality for PVD carbon with reactive gas and bias power
APPLIED MATERIALS INC0 citations51
US7498268B2Mar 3, 2009
Gas delivery system for semiconductor processing
APPLIED MATERIALS INC1 citations51
US10858735B2Dec 8, 2020
Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methods
APPLIED MATERIALS INC0 citations46
US10435786B2Oct 8, 2019
Alignment systems employing actuators providing relative displacement between lid assemblies of process chambers and substrates, and related methods
APPLIED MATERIALS INC0 citations46
US10566177B2Feb 18, 2020
Pulse shape controller for sputter sources
APPLIED MATERIALS INC0 citations41
US10858727B2Dec 8, 2020
High density, low stress amorphous carbon film, and process and equipment for its deposition
APPLIED MATERIALS INC0 citations40