Inventor
NG CHEE-HAU
SG7 patents
Patents
7 patentsUS11670567B2Jun 6, 2023
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP2 citations70
US12080622B2Sep 3, 2024
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP0 citations59
US11398548B2Jul 26, 2022
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations59
US10903314B2Jan 26, 2021
Semiconductor device and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations59
US12300534B2May 13, 2025
Method of forming protective layer utilized in silicon remove process
UNITED MICROELECTRONICS CORP0 citations49
US12324168B2Jun 3, 2025
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations48
US10622253B2Apr 14, 2020
Manufacturing method of semiconductor device
UNITED MICROELECTRONICS CORP0 citations44